Photosensitive resin composition, photosensitive element, resist pattern forming method and method for manufacturing printed circuit board

A technology for photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve problems such as long exposure time, and achieve the effect of shortening the process and improving the pass rate

Active Publication Date: 2013-04-17
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above-mentioned direct drawing exposure method, when using a composition having the same level of sensitivity as the photosensitive resin composition used in the conventional exposure method through a photomask, a long exposure time is usually required.

Method used

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  • Photosensitive resin composition, photosensitive element, resist pattern forming method and method for manufacturing printed circuit board
  • Photosensitive resin composition, photosensitive element, resist pattern forming method and method for manufacturing printed circuit board
  • Photosensitive resin composition, photosensitive element, resist pattern forming method and method for manufacturing printed circuit board

Examples

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Comparison scheme
Effect test

Embodiment

[0144] Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these Examples.

[0145][Synthesis 1 of binder polymer (component (A))]

[0146] In a flask with a stirrer, a reflux cooler, a thermometer, a dropping funnel, and a nitrogen inlet tube, add 500 g of a complex of methyl cellosolve and toluene at a mass ratio of 3:2, stir while blowing in nitrogen, and heat to 80°C. On the other hand, a solution (hereinafter referred to as "solution a") in which 150 g of methacrylic acid, 175 g of cyclohexyl methacrylate, 175 g of styrene, and 12.5 g of azobisisobutyronitrile were mixed was prepared as a comonomer. In the previously prepared complex of methyl cellosolve and toluene at a mass ratio of 3:2, the above-mentioned solution a was added dropwise over 4 hours, and then kept at 80° C. for 2 hours while stirring. Furthermore, a solution in which 1.0 g of azobisisobutyronitrile was dissolved in 250 g of a complex of methyl cello...

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Abstract

The invention provides a photosensitive resin composition comprising (A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group obtained from a specific styrene compound and its derivative, 5-55 parts by weight of a divalent group obtained from a specific (meth)acrylic acid ester and its derivative and 15-50 parts by weight of a divalent group obtained from (meth)acrylic acid, (B) a photopolymerizing compound and (C) a photopolymerization initiator.

Description

technical field [0001] The present invention relates to a method for forming a photosensitive resin composition, a photosensitive element, and a resist pattern, and a printed wiring board. Background technique [0002] In the field of production of printed wiring boards, as a resist material for etching or plating, etc., photosensitive elements (laminates) are widely used, which have a structure in which a photosensitive resin composition is formed on a support film or contains The layer of this photosensitive resin composition (hereinafter referred to as "photosensitive resin composition layer") has a structure in which a protective film is disposed on the photosensitive resin composition layer. [0003] Conventionally, a printed wiring board has been produced, for example, in the following procedure using the above-mentioned photosensitive element. That is, first, a photosensitive resin composition layer of a photosensitive element is laminated on a circuit-forming substr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/033G03F7/004G03F7/031H05K3/00H05K3/06H05K3/18
CPCG03F7/033G03F7/004C08F212/08C08F2220/1841C08F220/14C08F220/06C08F2220/1833H05K3/064G03F7/031C08F220/1806C08F220/1811C08F220/1812G03F7/0045G03F7/20G03F7/2002
Inventor 南川华子宫坂昌宏村松有纪子
Owner RESONAC CORPORATION
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