Patching method for circuit board

Abstract

The invention discloses a patching method for a circuit board. The method comprises the following steps of: 1) making a plastic patch template; 2) brushing soldering paste on the circuit board; 3) sticking a corresponding element at a corresponding position; and 4) welding the stuck element by using a reflow welder. In the step of welding the stuck element by using the reflow welder, the circuit board is welded by the reflow welder according to welding temperature and welding time which are set based on a reflow welding characteristic curve, the component of the soldering paste is Sn63 / Pb37 and the melting point is 183 DEG C. The patching method for the circuit board has the advantages of effectively ensuring the welding quality of the element, greatly improving the welding efficiency of a patched element, lowering the requirements of the patched element / chip on the professional welding skills of production personnel and greatly lowering the processing cost of the patched element. An operation method is simple and practical and has high application and popularization value.

Description

technical field [0001] The invention relates to a patching method for circuit boards. Background technique [0002] At present, in the production process of standard products, some circuit boards have fewer SMD components, new product experimental production or when the production cycle is relatively urgent and cannot be outsourced for SMT processing, SMD components are manually soldered However, this method has the following disadvantages: 1. Due to the small size of the chip components, small pads, and many pins, there are extremely high requirements for employees' welding skills and appropriate welding temperature, and a slight error will lead to The performance of components fails, causing hidden dangers to product quality; 2. The production efficiency of manual welding is low, and the construction period is long, which often affects the delivery cycle. Therefore just need to develop a kind of patch welding method that does not need to consume the time of professional w...

AI Technical Summary

Problems solved by technology

[0002] At present, in the production process of standard products, some circuit boards have fewer SMD components, new product experimental production or when the production cycle is relatively urgent and cannot be outsourced for SMT processing, SMD components are manually soldered However, this method has the following disadvantages: 1. Due to the small size of the SMD components, small pads, and many pins, there are extremely high requirements for the soldering skills of the employees and the appropriate soldering temperature, and a slight error will lead to The performance of components fails, causing hidden dangers in product quality; 2. Manual welding has low production efficiency and long construction period, which often affects the delivery cycle

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