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Semiconductor refrigerating cooling pad for laptop

A notebook computer and semiconductor technology, applied in electrical digital data processing, instruments, digital data processing components, etc., can solve the problem of insufficient heat dissipation capacity of the heat dissipation pad, and achieve the effect of strong heat dissipation capacity and low cost

Inactive Publication Date: 2011-02-23
UNIV OF SHANGHAI FOR SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention is aimed at the problem of insufficient cooling capacity of the existing cooling pads for notebook computers, and proposes a semiconductor refrigeration cooling pad for notebook computers, which cools down the notebook computer in a cooling manner, greatly improving the cooling capacity of the notebook computer

Method used

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  • Semiconductor refrigerating cooling pad for laptop
  • Semiconductor refrigerating cooling pad for laptop
  • Semiconductor refrigerating cooling pad for laptop

Examples

Experimental program
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Embodiment Construction

[0010] Such as Figure 1~2 The notebook computer semiconductor refrigeration heat dissipation pad shown includes semiconductor refrigeration sheet 4, heat conduction plate 3, notebook computer seat cushion 1, fin 5, fan 6, power switch 7 and indicator light and so on. There are four cushion pillars 2 under the seat cushion 1 of the notebook computer, and the heat conduction plate 3 is placed in the cushion 1 of the notebook computer, facing the notebook hard disk and the CPU area. The refrigerating sheet 4 starts to refrigerate, and the cold generated on the upper surface of the semiconductor refrigerating sheet 4 passes to the bottom of the notebook computer through the heat conducting plate 3, thereby dissipating heat to the notebook computer. Fin 5 and fan 6 are housed on the lower surface of semiconductor refrigerating sheet 4, and the two work together to dissipate the heat at the hot end of semiconductor refrigerating sheet 4 to ensure the cooling effect of semiconductor...

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Abstract

The invention relates to a semiconductor refrigerating cooling pad for a laptop. A semiconductor refrigerating piece is the core of equipment, arranged in a cushion of the laptop and opposite to a laptop hard disk and a central processing unit (CPU) area, and provides cold quantity required by cooling the laptop; a heating conducting plate quickly and approximately uniformly diffuses the cold quantity produced by the semiconductor refrigerating piece to the lower part of the laptop; and a fan and a fin assist the hot end of the semiconductor refrigerating piece in dissipating heat to enhance the refrigerating effect of the cold end of the semiconductor refrigerating piece. The semiconductor refrigerating cooling pad for the laptop has high heat dissipation capability and low manufacturing cost, is light and portable, and can solve the problems of blue screen and crash caused by overhigh temperature of a CPU and a display card for large computer software users, computer game enthusiasts and users who are fond of realizing the overclocking phenomenon of the CPU.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a notebook computer semiconductor cooling heat dissipation pad. Background technique [0002] At present, with the development and continuous upgrading of various large-scale software, the problem of poor heat dissipation of notebook computers is particularly prominent. When the CPU, graphics card and other components of a notebook computer run at high speed, they will generate a lot of heat. There is also a kind of computer enthusiast who is very keen on "computer overclocking", so that the operation of the computer exceeds its rated safety parameters, allowing it to reach a higher level. Fast calculation speed, while the computer is running at a high load at this time, it will generate more heat, poor heat dissipation will cause the computer to run slower, and even crash or burn computer components. [0003] Due to various reasons, there is no device that solves the heat dissipatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 余敏马龙茅今哲刘亚
Owner UNIV OF SHANGHAI FOR SCI & TECH
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