Rapid forming process of plastic carrier band

Abstract

The invention discloses a rapid forming process of a plastic carrier band, which comprises the following steps: firstly drying two types of plastic particles; then placing the two types of the dried plastic particles in an extruding machine for extruding the plastic particles into a plate, wherein one type of the plastic particles form a middle layer of the plate, and the other type of the plastic particles form an upper surface layer and a lower surface layer of the plate; utilizing the vacuum plastic sucking forming way to prepare the plate into the carrier band when the plate is not cooled; and finally carrying out punching operation, cutting operation and finished product rolling treatment. The rapid forming process of the plastic carrier band can arbitrarily select appropriate materials for manufacturing the carrier bands and use the arbitrary combination way to manufacture different finished products which can meet the requirements of clients on the properties of the carrier band finished products; the rapid forming process utilizes the compound technology and can use other materials to reinforce the physical defects of certain materials and utilize the materials with low unit price to replace the using ratio of expensive materials so as to reduce the cost; and the length and the thickness of the finished products can be arbitrarily adjusted, thereby greatly simplifying the complex production process of traditional carrier band forming factories.

Description

technical field [0001] The invention relates to a carrier tape forming process, in particular to a process for producing a plastic carrier tape by using a particle forming machine. Background technique [0002] Carrier tape refers to the plastic carrier widely used in packaging of SMT electronic components such as IC, resistors, inductors, capacitors, connectors, LEDs, fuses, switches, relays, connectors, oscillators, diodes, and triodes. At present, there are many kinds of processes for producing plastic carrier tapes. For example, some manufacturers directly use plastic particles to be pressed into thin plates to process and manufacture carrier tapes after slitting. The machine is pressed into sheets of various thicknesses, and the sheets are cut into single rolls by a professional cutting factory (the cutting width, thickness and material must be strictly classified), and finally the carrier tape molding factory is used for different lengths, different widths and differen...

AI Technical Summary

Problems solved by technology

[0004] The carrier tape processed by the above method accounts for 30-40% of the width of the formed plate at the left and right sides of the positioning punching and cutting. Because these tape edges are wasted in vain, the utilization rate of the material is very low, and the leftovers cannot be obtained. Real-time and effective use will increase the cost of plastic particles by 20-30%, which will relatively reduce competitiveness, especially for some special and expensive materials, such waste materials will seriously increase the production cost of enterprises

In addition, because the current carrier tapes are all single materials, limited by the physical properties of plastic particles, the materials cannot be modified during the manufacturing process, resulting in some materials that cannot be produced or limited to certain materials. Different reasons such as fluidity, molecular weight, heating color change, etc.), compared with some materials with poor toughness, it cannot be manufactured into a carrier tape under this process

Moreover, due to the limitation of a single material, there is very little room for the material to control the cost flexibly, and the cost of some products is too high and the profit is too thin

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