Displacement loading device and method for flexible electronic device

Abstract

The invention relates to a displacement loading device and a displacement loading method for a flexible electronic device, and belongs to the technical fields of engineering materials, structural deformation and mechanical experiment equipment. The device comprises a bracket, a guide rail, two identical square iron blocks, a spring, two wires and a direct-current power supply, wherein one square iron block moves along the guide rail, and the other square iron block is fixed on the guide rail; the sections of the two square iron blocks are square and have the same area; the two ends of the spring are fixed on the two square iron blocks respectively; the two wires are wound on the two square iron blocks in the same turning direction and with the same number of turns, and are connected with the direct-current power supply respectively; and the two square iron blocks are provided with a fixture respectively. The high-accuracy displacement control of a thin film structure, a microscale beam structure and the like in the flexible electronic device is realized through direct current with high control accuracy, so that the defects caused by machining accuracy limitation on a mechanical loading device, and temperature control limitation and thermal expansion coefficient measurement accuracy limitation on a thermal strain loading device are overcome.

Description

technical field [0001] The invention relates to a displacement loading device and method for a flexible electronic device, belonging to the technical fields of engineering materials, structural deformation and mechanical experiment equipment. Background technique [0002] In flexible electronic device technology, high-precision displacement control of some structures (such as thin films, microscale beams) is often required. At present, the implementation of this type of loading often relies on mechanical means, such as using a screw mechanism to convert rotational motion into linear motion; or using thermal strain means, such as thin film specimens with a small thermal expansion coefficient and a film specimen with a large thickness and a large thermal expansion coefficient. The substrates are bonded together, and the deformation of the substrate is large after changing the temperature, which will drive the film specimen to undergo obvious deformation. However, with the adv...

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Problems solved by technology

However, with the advancement of technology, the feature size of flexible electronic devices is getting smaller and smaller, and the precision requirements for displacement control are getting higher and higher, while the mechanical loading device is limited by machining accuracy, and the thermal strain loading device is limited by temperature control. and the accuracy of thermal expansion coefficient measurement, so the loading accuracy of the two is increasingly insufficient, and it is urgent to develop new displacement loading devices and methods

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