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Method for making metal mother board

A production method and metal technology, applied in the direction of copying and printing of printing plates, can solve the problems of low electroforming strength, low efficiency and low precision.

Active Publication Date: 2013-04-03
SVG TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are still two problems in this method. First, because the metal sub-plates are relatively thin, and because the joints are all a very thin straight line, the strength of the electroforming is not high, and it is easy to break in the later imprinting application; Second, when splicing sub-boards and sub-boards, human eyes need to observe the alignment, which not only reduces efficiency, but also lowers precision

Method used

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  • Method for making metal mother board
  • Method for making metal mother board
  • Method for making metal mother board

Examples

Experimental program
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Embodiment Construction

[0023] Please refer to figure 1 , figure 1 It is the production flow chart of the metal mother board of the first embodiment of the present invention. As shown in the figure, the first step is step S11: the pre-made metal daughter boards are spliced ​​according to the required master board layout patterns. The splicing action is best performed on a flat table, because the thickness of the metal sub-board is often only tens of microns, and the thickness difference between different metal sub-boards is also less than 10um, so it is flat for splicing. Degree requirements are very high.

[0024] Then step S12: After the splicing is completed, the patterned road surface is upward, and the seams are attached and fixed on the patterned road surface with adhesive tape to make the metal sub-boards difficult to separate and form a large-sized metal mother board with gaps. The tape used is preferably acid-resistant, alkali-resistant, and high-temperature resistant tape to avoid corrosion b...

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Abstract

The invention relates to a method for making a metal mother board. The metal mother board is made by splicing at least two metal daughter boards together, and each metal daughter board has lines of a laser image. In the method, an abutted seam between the at least two metal daughter boards is stuffed mainly in an electroforming manner, wherein a concave-convex structure is arranged on the abuttededge of each metal daughter board, and the concave-convex structures of adjacent daughter boards are matched with each other. By adopting the concave-convex structures, the electroforming strength among metal daughter boards is increased, simple and accurate counterpoint is also realized, and the quality of the finished product of the metal mother board is improved.

Description

Technical field [0001] The invention relates to a manufacturing method of a metal mother board, in particular to a manufacturing method of a metal mother board adopting an electroforming imposition type. Background technique [0002] Laser light variable images are used as anti-counterfeiting marks because of their difficulty in making and high barriers to entry. They are widely used in packaging, certificates, stamps, cards and coins. A high-efficiency laser light variable image production method is to transfer a pattern with a specific shape from a metal mother board to the product to be imprinted by embossing. Therefore, the production of metal mother boards has become the key to this technical method. [0003] With the development of the market, people have higher and higher requirements for laser patterns on metal mother boards, and it is often necessary to design laser patterns with multiple visual effects on a metal mother board. However, laser patterns with different visu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41C3/08
Inventor 吴智华周小红申溯魏国军浦东林陈林森
Owner SVG TECH GRP CO LTD