Substrate exchanging module for substrate processing apparatus and substrate processing apparatus having the same
A technology for switching modules and processing devices, applied in transportation and packaging, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of increased installation costs and total installation costs, and achieve the effect of reducing manufacturing costs
Inactive Publication Date: 2011-04-20
WONIK IPS CO LTD
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Problems solved by technology
Therefore, even if the installation area of the substrate processing apparatus is increased by a small amount, the installation cost will increase significantly
[0009] In addition, since conventional substrate processing equipment requires multiple modules, the total installed cost of the equipment increases when the number of modules increases
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[0032] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
[0033] Hereinafter, a substrate exchange module of a substrate processing apparatus and a substrate processing apparatus having the module according to the present invention will be explained in detail with reference to the accompanying drawings.
[0034] As shown in FIGS. 1 and 2, a substrate processing apparatus according to the present invention includes one or more processing modules 100 configured to process a plurality of substrates 10 loaded on a tray 20; The module 100 is connected to the substrate exchange module 200 . Here, a gate valve 160 is arranged between the substrate exchange module 200 and the processing module 100 .
[0035] As shown in Figures 1 and 2, the processing module 100 includes a vacuum housing 110, which constitutes a vacuum space S for performing vacuum processing; and a substrate support unit 120 with a lower electrode installed ...
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The invention discloses a substrate processing apparatus, especially discloses a substrate exchanging module capable of conducting predetermined processing on the substrate and a substrate processing apparatus having the module. The substrate exchanging module of the substrate processing apparatus is connected to one or a plurality of processing modules, and the processing module is configured tobe used for processing a plurality of substrates stacked up on a tray. The substrate exchanging module comprises a substrate exchanging unit and a tray transfer unit. The substrate exchanging unit consists of a tray used for supporting and containing a plurality of substrates and a tray moving up and down unit which is capable of exchanging a processed substrate with a substrate to be processed. The tray moving unit is configured to be used for receiving the tray loaded with a plurality of substrates to be processed from the substrate exchanging unit and introducing the tray into the processing module, and is also configured to be used for withdrawing the tray loaded with a plurality of processed substrates from the processing module and transferring the tray to the substrate exchange unit.
Description
technical field [0001] The invention relates to a substrate processing device, in particular to a substrate exchange module capable of performing predetermined processing on a substrate and a substrate processing device with the module. Background technique [0002] The substrate processing apparatus is used to perform at least one predetermined processing on at least one substrate. A substrate processing apparatus includes a housing constituting a sealed processing space, and a substrate supporting unit installed in the housing and configured to support at least one substrate. The substrate processing device refers to a device for performing etching or deposition processing by energizing the surface of at least one substrate while injecting at least one gas into the processing space. [0003] The substrates processed by the substrate processing device include wafers of semiconductor devices, glass substrates of liquid crystal panels, and substrates of solar cells. [0004...
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IPC IPC(8): H01L21/677H01L21/683H01L21/00
CPCH01L21/6773H01L21/67739H01L21/68742
Inventor 金炳埈
Owner WONIK IPS CO LTD