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Integrated circuit and electronic apparatus

An integrated circuit and circuit layer technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of circuit size and working current increase, and achieve the effect of resistance

Inactive Publication Date: 2011-04-20
SONY GRP CORP
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0027] When the first method described above is used, the circuit size and operating current are increased

Method used

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  • Integrated circuit and electronic apparatus
  • Integrated circuit and electronic apparatus
  • Integrated circuit and electronic apparatus

Examples

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no. 1 example

[0053] 2. The second embodiment

[0054] 1. The first embodiment

[0055] Figure 5 Parts (A) to (C) are diagrams illustrating one example of a secure semiconductor LSI having an encryption processing circuit according to the first embodiment of the present invention.

[0056] The secure LSI 100 is formed as a non-contact IC card as an electronic device.

[0057] For example, if Figure 5 As shown in part (A) of (A), the security LSI 100 according to the first embodiment shown as an example uses a semiconductor layer (silicon (Si) layer) and five metal wiring patterns formed on the semiconductor layer and formed therein. Metal layers are formed to constitute an IC chip in which a semiconductor circuit is formed.

[0058] Configurations and functions are assigned to each metal layer, for example as described below.

[0059] The configuration and function of the layer in which the signal line in the horizontal direction is formed is assigned to the first metal layer (1MT) 1...

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Abstract

An integrated circuit includes a semiconductor-circuit layer; metal layers formed on the semiconductor-circuit layer, one of the metal layers being a metal layer in which an active shield is formed; and an antenna formed by patterning in at least one of the metal layers that are below the metal layer in which the active shield is formed. The semiconductor-circuit layer includes an encryption circuit configured to receive a drive voltage and to perform encryption arithmetic; a power-supply circuit configured to provide the drive voltage to the encryption circuit; and a circuit system configured to receive a power-supply voltage from an external power supply.

Description

technical field [0001] The present invention relates to integrated circuits and electronic devices including encryption circuits therein. Background technique [0002] With regard to integrated circuit (IC) cards, when data transmission / reception is performed between the IC card and the host computer, in order to prevent leakage even if confidential information stored in the IC card occurs during data transmission / reception A problem occurred and encrypted data was used as data to be sent / received. [0003] The method currently most commonly used as a method for encrypting such data is the Data Encryption Standard (DES). [0004] In DES, in order to encrypt data, the owner of such an IC card and the host computer have the same key. Also, in DES, the sender of data encrypts the data using a key, and sends the encrypted data. The recipient of the data decrypts the data using the same key and extracts the message. [0005] Even when a malicious third party obtains the data ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/02H01L23/58G06K19/077
CPCG06K19/07363G06K19/0723G06F21/77G06F21/60G06K19/07771G06K19/07775G06F21/755
Inventor 信方浩美
Owner SONY GRP CORP
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