Substrate processing apparatus
A substrate processing device and substrate technology, which is applied in the fields of transportation and packaging, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of wafer W handover and other issues, and achieve the effect of improving productivity and suppressing the decline in operation rate
Active Publication Date: 2011-04-27
TOKYO ELECTRON LTD
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Problems solved by technology
Therefore, when there is a defect in the components and transport members in the second processing area S3, the wafer W cannot be delivered to the third processing area S4, so even if the technology described in Patent Document 2 is applied, the liquid processing cannot be performed sometimes. Efficient operation of the device
Method used
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[0040] Next, as an embodiment of the substrate processing apparatus of the present invention, the configuration of a liquid processing apparatus 10 for supplying a processing liquid onto a wafer W as a substrate to remove particles adhering to the substrate will be described with reference to the drawings. , Remove pollutants. First, refer to figure 1 Briefly explaining the general situation of the present invention, the liquid processing apparatus 10 of the present invention includes: a carrier loading area 1, and a carrier C that accommodates a plurality of wafers W is loaded into the carrier loading area 1 from the outside or from the carrier loading area 1. The carrier loading area 1 carries out the carrier C to the outside; the transfer area 2, which has a transfer portion of the wafer W; a plurality of, for example, three processing areas (the first processing area 31, the second processing area 32 and the third processing area). processing area 33 ), which is used to p...
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Disclosed is a substrate processing apparatus which can achieve an improvement in throughput and suppress the reduction in the operation rate of the entire apparatus even when a problem occurs. In the disclosed apparatus, at the rear end of a substrate loading block including a loading / unloading arm for transferring a wafer to a carrier, a first, a second, and a third processing blocks are disposed in that order. In the substrate loading block, transfer stages are provide for transferring a wafer from the loading / unloading arm to the first processing block, for transferring a wafer to the second processing block, and for transferring a wafer to the third processing block so that the wafer on the transfer stage is directly carried to the second processing block by a first direct carrying mechanism, and to the third processing block by a second direct carrying mechanism.
Description
technical field [0001] The present invention relates to a substrate processing apparatus including a processing section and a section for taking out substrates from a transport container, the processing section including a plurality of processing units for processing substrates one by one. Background technique [0002] Liquid processing is performed in the manufacturing process of semiconductor devices, etc., by supplying processing liquids such as chemical liquids and pure water onto the surface of substrates such as semiconductor wafers (hereinafter referred to as wafers), and removing particles adhering to the substrates. (particle), removal of pollutants. [0003] As one type of liquid processing apparatus that performs the above-mentioned liquid processing, there is a liquid processing apparatus that places substrates one by one on a spin chuck, and then supplies a processing liquid onto the surface of the substrate while rotating the substrate. Perform liquid handling...
Claims
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Login to View More IPC IPC(8): H01L21/677H01L21/00
CPCH01L21/67178H01L21/67051H01L21/67742H01L21/67173H01L21/67184Y10T29/53313Y10T29/534Y10T29/53365
Inventor 石田省贵齐藤幸良
Owner TOKYO ELECTRON LTD