Welding pad structure of circuit board and manufacturing method of welding pad structure
A technology for circuit boards and soldering pads, which is applied to printed circuit components, electrical connection printed components, and secondary processing of printed circuits, etc. It can solve the problems of printing solder paste process yield decline, circuit board reliability problems, and poor bonding force And other issues
Active Publication Date: 2012-12-12
UNIMICRON TECH CORP
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Problems solved by technology
[0008] The aforementioned prior art includes the following disadvantages: (1) Since the line spacing of the welding pad structure 2 on the contact surface of the flip chip (Flip Chip) of the circuit board is getting smaller and smaller, the yield rate of the printing solder paste process is reduced; (2) ) The bonding force between the solder material 6 and the solder resist layer 4 is not good; (3) Before the nickel-gold process, the chemical micro-etching and cleaning process caused the undercut 4b formed at the bottom of the solder resist opening 4a to be in the subsequent A high stress point is formed in the process, causing reliability problems of the circuit board
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[0034] See Figure 6 to Figure 9 , Which is a schematic diagram of a manufacturing method of a solder pad structure on a circuit board according to a preferred embodiment of the present invention. First, like Image 6 As shown, a surface circuit structure 10a has been formed on the surface of the circuit board 10, including a plurality of copper pad structures 20 and fine circuit structures 30. The circuit board 10 may be a single-layer circuit board, a double-layer circuit board, or a multilayer circuit board. To simplify the description, the conductive vias and other inner layer circuit structures in the circuit board 10 are not specifically drawn.
[0035] After the surface circuit structure 10a is completed, a non-conductor solder mask 120 is then coated on the surface of the circuit board 10. The non-conductor solder mask 120 may include a dielectric matrix and laser-activated catalytic particles. Wherein, the aforementioned catalytic particles are uniformly dispersed in t...
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The invention discloses a method for manufacturing a welding pad structure of a circuit board. The method comprises the following steps: firstly, providing the circuit board on which is at least one copper cushion structure is provided; then, forming a sold-mask layer on the surface of the circuit board; and forming a welding-pad opening on the sold-mask layer by laser by way of ablation so as to expose part of the copper cushion structure, and simultaneously, and forming a laser activation layer on the side wall of the welding-pad opening by the laser; and finally, simultaneously growing smelting coppers on the laser activation layer on two opposite side walls of the welding-pad opening and the welding pad structure.
Description
Technical field [0001] The present invention relates to the technical field of circuit board manufacturing, in particular to a circuit board soldering pad structure and a manufacturing method thereof. Background technique [0002] In recent years, with the rapid development of electronics and semiconductor technology, more user-friendly, better-functioning electronic products have been continuously introduced and designed toward the trend of light, thin, short, and small. In order to comply with this trend and trend, the circuits on the circuit board or package substrate must be made thinner and denser, so as to form a package structure with high density and multi-pin characteristics. [0003] See Figure 1 to Figure 5 , Which shows a schematic diagram of the existing solder mask process and the solder paste printing process after solder mask. Such as figure 1 As shown, a surface circuit structure 1a has been formed on the surface of the circuit board 1, including a plurality of b...
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IPC IPC(8): H05K3/40H05K3/24H05K1/11
Inventor 曾子章江书圣
Owner UNIMICRON TECH CORP