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Curable compositions

一种固化性组合物、固化促进剂的技术，应用在粘合剂类型、黏合剂添加剂、酯共聚物粘合剂等方向，能够解决低应力性、固化难以充分进行、物性不充分等问题，达到耐冲击粘合强度高、热冲击性良好、残留应力低的效果

Active Publication Date: 2011-05-11
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the capsule-type one-liquid acrylic adhesive has a slow curing speed, which cannot reduce costs and increase productivity. In addition, when both adherends are large objects, the microcapsules are smaller than the gap between the adherends, and it is difficult to fully cure. ongoing question
In addition, when applied to product groups that require high durability in terms of moisture resistance, heat resistance, impact resistance, low stress, and high toughness, there is still a problem of insufficient physical properties.

Method used

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  • Curable compositions

Examples

Experimental program
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Effect test

Embodiment 1

[0100] The curable composition of Example 1, when the total amount of the compounded substances is 126.2 parts by mass, is respectively: Microcapsules [gelatin film 15% by mass, Percumyl H80 (manufactured by NOF Corporation, cumene hydroperoxide 80 %) 30% by mass, tricresyl phosphate (manufactured by Daihachi Chemical Industry Co., Ltd.) 55% by mass, particle diameter of 180 μm or more, average particle diameter of 300 μm] 10 parts by mass, vanadium acetylacetonate (manufactured by Shinshin Chemical Co.) 0.5 parts by mass, formazan Acrylic acid (manufactured by Mitsubishi Gas Chemical Co., Ltd.) 15 parts by mass, dicyclopentenyl oxide ethyl methacrylate (manufactured by Rohm & Haas, QM-657) 45 parts by mass, polyethylene oxide (10 mol) modified bisphenol A Dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., BPE500) 25 parts by mass, NBR (manufactured by JSR Corporation, N260S) 5 parts by mass, MBS (manufactured by Kureha Chemical Industry Co., Ltd., BTA712) 15 par...

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PUM

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Abstract

Fast-setting curable compositions which can satisfactorily bond adherends even when a gap is formed between the adherends as far as the size of the gap is about 100[mu]m or below. A curable composition comprising at least one organic peroxide, a cure accelerator which can react with the peroxide to accelerate the polymerization of monomers, a monofunctional (meth)acrylate, and a polyfunctional (meth)acrylate, characterized in that the peroxide is enveloped in microcapsules, preferably, a curable composition as described above, characterized in that the monofunctional (meth)acrylate contains both a (meth)acrylate bearing a carboxyl group and a (meth)acrylate bearing an alicyclic hydrocarbon.

Description

technical field [0001] The present invention relates to an acrylic curable composition, especially an acrylic room temperature curable composition for bonding. Background technique [0002] Conventionally, a two-component acrylic pressure-sensitive adhesive has been known as a room-temperature-curable acrylic pressure-sensitive adhesive composition. As a representative example, a second-generation acrylic adhesive (SGA) is known. [0003] SGA can be divided into two types from the double-dose form used. One is the so-called one main agent one auxiliary agent type (primer type), which adds a curing initiator to the main agent mainly composed of acrylic monomers to form a main agent, and dissolves or disperses the curing accelerator A liquid in a solvent or the like is used as a primer (a secondary agent). The other is a dual-main formulation in which an acrylic monomer and a curing initiator are added to one of the two components, and an acrylic monomer and a curing accele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F20/04C08F2/32C09J11/06C09J133/08
CPCC08K5/14C08K9/10C09J133/08C08F220/1811C08F222/1025C08F222/103Y10S525/936
Inventor 小林庆太依田公彦渡边淳
Owner DENKA CO LTD
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