Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and device for measuring total hemispherical emissivity of non-metallic material

A technology of non-metallic materials and full emissivity, which is applied in the field of measuring thermal physical parameters of materials, can solve the problems of inapplicable high-temperature non-metallic materials, low test accuracy, complicated devices, etc., achieve good uniformity, simple calculation, and ensure accuracy sexual effect

Active Publication Date: 2011-05-25
TSINGHUA UNIV
View PDF1 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The technical problem to be solved by the present invention is to provide a simple and reliable method and device for measuring the high-temperature hemispherical total emissivity of non-metallic materials, which overcomes that the existing hemispherical total emissivity measurement method cannot be applied to high-temperature non-metallic materials, and the device Disadvantages such as complexity and low test accuracy

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for measuring total hemispherical emissivity of non-metallic material
  • Method and device for measuring total hemispherical emissivity of non-metallic material
  • Method and device for measuring total hemispherical emissivity of non-metallic material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0031] refer to figure 1 , the method for measuring the hemispherical total emissivity of non-metallic materials in the embodiment of the present invention specifically includes the following steps:

[0032] Step 1, in a vacuum environment, select the central area of ​​the middle section of the sample to be tested in the shape of a multi-section cylindrical sleeve as the target analysis area.

[0033] Specifically: the vacuum environment is coated with high-emissivity paint to provide an environment similar to a black body, and the vacuum degree in the vacuum environment is less than 1×10 -3 Pa. The sample to be tested is a multi-section cylindrical sleeve-shaped non-me...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to the technical field of measurement of thermal physical parameters of a material, in particular to a method and a device for measuring total hemispherical emissivity of a non-metallic material. The measurement method comprises the following steps: selecting a center area in the middle section of a multi-section combined and cylindrical sleeve-shaped sample to be tested as a target analysis area in a vacuum environment; embedding a powered heating module into the sample to be tested in a penetrating way; and calculating the total hemispherical emissivity throughmeasuring the geometric dimensions of the middle section of the sample to be tested, the geometric dimensions of the target analysis area, the internal temperature of the vacuum environment in a thermal equilibrium state, and the surface temperature and the heat power of the middle section of the sample to be tested and the target analysis area. Since the heating module is embedded in the cylindrical sleeve-shaped sample to be tested, the demands are satisfied for measurement of the total hemispherical emissivity of the non-metallic material at high temperature, and the present invention has the advantages that the measurement device has a simple structure and high-precision measurement data can be obtained.

Description

technical field [0001] The invention relates to the technical field of measuring thermophysical parameters of materials, in particular to a method and device for measuring the hemispherical total emissivity of non-metallic materials. Background technique [0002] Hemispherical total emissivity is one of the important thermophysical parameters of materials, which characterizes the thermal radiation ability of the material surface, and is an important basic physical property data for the study of radiative heat transfer and thermal efficiency analysis. In the high-tech fields such as aerospace and energy power, new high-temperature resistant non-metallic materials are widely used. However, as the thermal physical property data to characterize the performance of materials, the high-temperature hemispherical emissivity of non-metallic materials is very scarce. [0003] At present, the measurement methods can be mainly divided into card meter method, reflectivity method, energy c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01N25/00G01K17/00
Inventor 符泰然谈鹏孟迎潮
Owner TSINGHUA UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products