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Manufacturing method of surface mounted device resistor

A manufacturing method and chip resistor technology, which is applied in the direction of resistor manufacturing, resistors, and resistors with lead-out terminals, can solve the problems of weakened market competitiveness, high production costs, and high prices, so as to enhance market competitiveness and ensure uniformity. The effect of excellent uniformity and uniformity

Active Publication Date: 2012-10-24
UNIROYAL ELECTRONICS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] 2. The printed silver paste material is used to form the front electrode of the chip resistor. After firing, the thickness is thicker and the amount used is larger, and the printed material is a sintered paste with silver as the main component. Its price is relatively high, resulting in product The production cost is high and the market competitiveness is weakened

Method used

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  • Manufacturing method of surface mounted device resistor
  • Manufacturing method of surface mounted device resistor
  • Manufacturing method of surface mounted device resistor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0052] Embodiment: A kind of manufacturing method of chip resistor, is based on using direction, and its manufacturing steps are as follows:

[0053] a. prepare an insulating substrate 1, and form a plurality of horizontal folding lines 2 and a plurality of longitudinal folding lines 3 on the upper surface 11 and the lower surface 12 of the insulating substrate evenly corresponding to the grid;

[0054] b. Print the silver paste on the lower surface 12 of the insulating substrate 1 at set intervals by screen printing, dry and sinter to form each back electrode 30, and the position of each back electrode 30 is to correspond to the horizontal fold The line 2 is the transverse center line and each back electrode 30 is located in the middle of two adjacent longitudinal folding lines 3;

[0055] c. Print the resistance paste on the upper surface 11 of the insulating substrate 1 by screen printing, dry and sinter to form each resistance layer 4, and the position of each resistance l...

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Abstract

The invention discloses a manufacturing method of a surface mounted device (SMD) resistor. The method for manufacturing a positive electrode of the SMD resistor comprises the following steps: firstly, printing a resistive layer; secondly, printing and covering a positive auxiliary electrode at both sides of a position in which the resistive layer is close to the positive electrode; and thirdly, sputtering to form the positive electrode, thus ensuring the connectivity between the positive electrode and the resistive layer and strengthening the stability of a product. The positive electrode is used for sputtering a conductive material which takes silver as a main composition in a vacuum sputtering mode. The sputtered conductive material can be sputtered uniformly to a substrate surface. A sputtered electrode layer has the advantages of thin film and excellent uniformity, thus ensuring the uniformity of the film thickness of the positive electrode and overcoming the shortcoming that the initial value of the resistor is easy-dispersed. Besides, the cost of the conductive material taking the silver as the main component is lower than that of silver paste, and the amount of the conductive materials is less, thus effectively reducing the production cost of products, improving the market competitiveness of the products and being suitable for batch production.

Description

technical field [0001] The invention relates to a method for manufacturing a resistor, in particular to a method for manufacturing a chip resistor. Background technique [0002] Chip resistors are widely used in electronic circuits. [0003] A typical chip resistor manufacturing method is as follows: [0004] 1. Use screen printing to form the front electrode on the front of the large insulating substrate, and dry it; [0005] 2. Form the back electrode by screen printing on the back of the above-mentioned insulating substrate, dry and fire; [0006] 3. A resistance layer is formed by screen printing on the inner side of the above-mentioned front electrode, dried and fired: both ends of the resistance layer are connected to the above-mentioned front electrode; [0007] 4. Form the first protective layer (i.e. glass protective layer) on the above-mentioned resistance layer, and carry out drying and firing; [0008] 5. For the above resistance layer, the resistance is prec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00H01C17/065H01C17/28H01C17/242
Inventor 王毅冯会军张军会赵武彦彭荣根刘冰芝张明华
Owner UNIROYAL ELECTRONICS IND
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