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Solution for inhibiting palladium activity including halogenic acid and method for preventing defect of plating using thereof

A hydrohalic acid and solution technology, applied in liquid chemical plating, coating, printed circuit manufacturing, etc., can solve the problems of application limitation, toxic environment of cyano compounds, depending on processing conditions, etc., and achieve the effect of reducing short circuit defects

Inactive Publication Date: 2011-06-08
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it causes unplated parts (Ni hopping defects) and plating extensions, which depend on processing conditions
[0006] In addition, the above-mentioned cyano compounds are toxic and environmentally unfriendly materials, so that their application may be limited, and it may eventually be necessary to replace them

Method used

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  • Solution for inhibiting palladium activity including halogenic acid and method for preventing defect of plating using thereof
  • Solution for inhibiting palladium activity including halogenic acid and method for preventing defect of plating using thereof
  • Solution for inhibiting palladium activity including halogenic acid and method for preventing defect of plating using thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0055] Example 1: HCl treatment as solution for inhibiting palladium activity

[0056] Electroless nickel plating was performed after preparing an insulating circuit board, treating it with a replacement palladium catalyst, immersing it in 2 molar aqueous HCl for 5 minutes, and rinsing it. image 3 Shown is the surface of a plate plated by treating the plate with a palladium catalyst, immersing it in an aqueous HCl solution for 5 minutes, and performing electroless nickel plating according to Example 1.

[0057] exist image 3 Note that it does not show partial unplating and shows less expansion than the plate plated according to comparative example 1.

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PUM

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Abstract

The present invention discloses a solution for inhibiting palladium activity including an aqueous halogenic acid solution as a pre-treatment solution which may be used before an electroless plating of a printed circuit board to prevent bad plating, and a method for preventing bad plating by using the same. More particularly, the invention discloses a solution for inhibiting palladium activity including 0.1 to 10 mol of an aqueous halogenic acid solution as a pre-treatment solution which may be used before an ENIG plating or ENEPIG plating of a printed circuit board to prevent bad plating. Disclosed is also a method for preventing bad plating by minimizing defects of shorts between patterns which are caused by plating spreading during the surface treatment of a printed circuit board having fine patterns.

Description

[0001] References to related patent applications [0002] This application claims the benefit of Korean Patent Application No. 10-2009-0120072 filed with the Korean Intellectual Property Office on December 4, 2009, the entire disclosure of which is incorporated herein by reference. technical field [0003] The present invention relates to a solution for inhibiting palladium activity to prevent bad plating (electroplating, plating) before ENIG plating or ENEPIG plating of printed circuit boards, and by using the solution to prevent The method of bad coating. Background technique [0004] Development has been carried out so that after ENIG (Electroless Nickel Immersion Gold) or ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) plating, when Plating deposits (deposits) such as Ni, Pd, and Au etc. are deposited and plated on the surface of the board, reducing or eliminating the gap between patterns caused by bridge or short circuit problems or plating spreading (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/42C23C18/32H05K3/18
CPCH05K2203/0789C23C18/1603C23C18/1841H05K2203/073C23C18/1651C23C18/1844C23C18/1608C23C18/2086H05K3/244C23C18/28C23C18/32C23C18/16
Inventor 权赫辰南孝昇金兑浩金宗植徐正旭
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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