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Etching method, method for manufacturing microstructure, and etching apparatus

A technology of microstructure and etching, which is applied in the manufacture of semiconductor/solid-state devices, originals for photomechanical processing, and photolithography of patterned surfaces, etc. It can solve problems such as etching, difficult maintenance of liquid composition, failure, etc.

Active Publication Date: 2011-06-22
KK TOSHIBA +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as mentioned above, it is difficult to maintain the liquid composition at a constant value, which may cause failure of stable etching

Method used

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  • Etching method, method for manufacturing microstructure, and etching apparatus
  • Etching method, method for manufacturing microstructure, and etching apparatus
  • Etching method, method for manufacturing microstructure, and etching apparatus

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Embodiment Construction

[0020] Embodiments of the present invention will now be described with reference to the accompanying drawings. In these drawings, the same components are marked with the same reference numerals, and their detailed descriptions are omitted as appropriate.

[0021] figure 1 is a schematic diagram of an etching apparatus according to one embodiment.

[0022] According to this embodiment, the etching device 5 includes a sulfuric acid electrolysis device 10 , an etching device 12 , an etching solution supply device 14 , a sulfuric acid supply device 15 , and a controller 76 .

[0023] The function of the sulfuric acid electrolysis device 10 is to electrolyze a sulfuric acid solution in the anode chamber 30 to generate oxidizing species, thereby producing an etching solution containing the oxidizing species.

[0024] The sulfuric acid electrolysis device 10 comprises an anode 32, a cathode 42, a membrane 20 arranged between the anode 32 and the cathode 42, an anode chamber 30 arr...

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PUM

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Abstract

In one embodiment, an etching method is disclosed. The method can include producing an oxidizing substance by electrolyzing a sulfuric acid solution, and producing an etching solution having a prescribed oxidizing species concentration by controlling a produced amount of the produced oxidizing substance. The method can include supplying the produced etching solution to a surface of a workpiece.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from prior Japanese Patent Application No. 2009-285433 filed on December 16, 2009; the entire contents of which are incorporated herein by reference. technical field [0003] Embodiments described herein generally relate to an etching method, a method of fabricating a microstructure, and an etching apparatus. Background technique [0004] In the field of semiconductor devices and MEMS (Micro Electro Mechanical Systems), microscopic structures with microscopic walls on the surface are produced by lithographic techniques. [0005] The resist is formed during the manufacturing process. The resist used was stripped with an SPM (sulfuric acid peroxide mixture) solution, which is a liquid mixture of concentrated sulfuric acid and hydrogen peroxide. This SPM solution is also used in the process of removing metals (see, for example, JP-A-2007-123330 (KOKAI)). [0006] Here, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25B1/30C25B1/28C25B1/13C25B15/02C25B15/08
CPCC25B1/22H01L21/31133G03F1/80H01L21/02057H01L21/6708C25B9/08G03F7/423C25B9/19
Inventor 田家真纪子速水直哉佐藤伸良米仓由里平林英明黑川祯明小林信雄加藤昌明土门宏纪
Owner KK TOSHIBA