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Selective laser sintered single-face powder supplying device realized by adopting powder returning groove

A powder feeding device, laser sintering technology, applied in laser welding equipment, process efficiency improvement, manufacturing tools and other directions, to achieve the effect of reducing the overall size, improving the reliability of the equipment, and reducing the complexity of the equipment

Inactive Publication Date: 2011-07-20
湖南美纳科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects of the existing SLS powder feeding device, provide a selective laser sintering single-sided powder feeding device with simple structure and convenient operation, and reduce SLS while ensuring that the SLS double-pass powder feeding and spreading requirements are met. Reduce equipment size, reduce equipment complexity, reduce equipment cost, and improve equipment reliability

Method used

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  • Selective laser sintered single-face powder supplying device realized by adopting powder returning groove
  • Selective laser sintered single-face powder supplying device realized by adopting powder returning groove
  • Selective laser sintered single-face powder supplying device realized by adopting powder returning groove

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Experimental program
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Effect test

Embodiment 1

[0013] Such as Figure 1A As shown in -D, 1 is the powder feeding cylinder below, 2 is the powder overflow cylinder, 3 is the powder spreading roller, 4 is the powder returning tank, and the powder returning tank 4 includes the cylinder body 5, the movable bottom plate 6 and the control connected with the movable bottom plate The shaft 7, the powder feeding cylinder 1 and the powder overflow cylinder 2 are located on the left side of the working cylinder 9, and the powder return tank 4 is located on the right side of the working cylinder 9. Such as Figure 1A As shown, the powder feeding cylinder 6 first supplies the quantitative powder material 8 of the working platform 10, and the amount of the powder material supplied is slightly greater than the amount of powder required for two powder spreading, and the powder spreading roller starts from the left and goes right to spread the powder. At the same time, the control shaft 7 controls the movable bottom plate 6 of the powder re...

Embodiment 2

[0015] Such as Figure 2A As shown in -D, 1' is the upper feeding powder cylinder, 2 is the powder overflow cylinder, 3 is the powder spreading roller, 4 is the powder return tank, and the powder return tank 4 includes the cylinder body 5, the movable bottom plate 6 and the movable bottom plate The control shaft 7, the powder feeding cylinder 1 and the powder overflow cylinder 2 are located on the left side of the working cylinder 9, and the powder return tank 4 is located on the right side of the working cylinder 9. Such as Figure 2A As shown, the powder feeding cylinder 6 first supplies the quantitative powder material 8 of the working platform 10, and the amount of the powder material supplied is slightly greater than the amount of powder required for two powder spreading, and the powder spreading roller starts from the left and goes right to spread the powder. At the same time, the control shaft 7 controls the lower position of the movable bottom plate 6 of the powder re...

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Abstract

The invention provides a selective laser sintered single-face powder supplying device realized by adopting a powder returning groove. The selective laser sintered single-face powder supplying device comprises a powder spreading roller, a powder supplying cylinder, a powder overflowing cylinder and the powder returning groove, wherein the single-face powder supplying device only needs to install one powder supplying cylinder and one powder overflowing cylinder at one side of a worktable and install one powder returning groove at the other side of the worktable; and the powder returning groove comprises a cylinder body, a movable bottom plate, and a control shaft connected with the movable bottom plate. In the invention, the equipment space is saved; the equipment dimension is reduced; the equipment complexity is reduced; the equipment cost is effectively reduced; the equipment reliability is improved; and the SLS (Set Location Stack) process requirements are further met.

Description

technical field [0001] The invention belongs to the field of advanced manufacturing technology, and relates to a single-side powder feeding device for selective laser sintering, in particular to a single-side powder feeding device for selective laser sintering realized by using a powder returning groove. Background technique [0002] Selective Laser Sintering (SLS) is a widely used rapid prototyping (RP) technology, which uses solid powder materials as raw materials to directly convert CAD models into entities. Theoretically, any thermally bonded powder has the possibility of being used as a raw material for SLS, such as polymers, ceramics, metal powders and various composite powder materials. In the SLS process, the powder feeding and spreading technology directly affects the quality of the SLS process, and the powder feeding and spreading device directly affects the structure, size and reliability of the equipment. [0003] In the SLS process, there are usually two powder...

Claims

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Application Information

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IPC IPC(8): B29C67/04B22F3/105B23K26/42B23K26/34
CPCY02P10/25
Inventor 许小曙邓美军赵太传
Owner 湖南美纳科技有限公司
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