Cryogenic treatment method and device for steel wire for cutting solar cell silicon chip
A solar cell, cryogenic treatment technology, applied in heat treatment furnaces, heat treatment equipment, furnaces, etc., can solve the problems of steel wire strength and wear resistance limitations, low complete transformation temperature, etc.
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Embodiment 1
[0044] The steel wire material is W18Cr4V, the diameter is Φ0.1mm, and the heating treatment process is as follows:
[0045] a) Cool the steel wire from room temperature at a rate of 0.5°C / min to -196°C for the first time for 1 hour;
[0046] b) Raise the temperature of the steel wire after the first heat preservation to 110°C at a rate of 0.6°C / min for a second heat preservation of 1.5h;
[0047] c) Cool the steel wire after the second heat preservation to -192°C ~ -196°C at a rate of 0.5°C / min for a third heat preservation of 1.2h;
[0048] d) Warm up the steel wire after the third heat preservation to room temperature at a rate of 0.5°C / min.
[0049] Use steel wire after cryogenic treatment to cut silicon wafers, cutting 120m 2 After breaking, compared with the steel wire without cryogenic treatment, the cutting area is increased by 25%.
Embodiment 2
[0051] The steel wire material is W18Cr4VCo5, the diameter is Φ0.1mm, and the cryogenic treatment process is as follows:
[0052] a) Cool the steel wire from room temperature at a rate of 0.5°C / min to -194°C for 0.8h for the first time;
[0053] b) Raise the temperature of the steel wire after the first heat preservation to 110°C at a rate of 0.8°C / min for a second heat preservation of 1.5h;
[0054] c) Lower the temperature of the steel wire after the second heat preservation to -192°C ~ -196°C at a rate of 0.7°C / min for a third heat preservation of 1.5h;
[0055] d) The steel wire after the third heat preservation is raised to room temperature at a rate of 0.6°C / min.
[0056] Use steel wire after cryogenic treatment to cut silicon wafers, cutting 110m 2 After breaking, compared with the steel wire without cryogenic treatment, the cutting area is increased by 22%.
Embodiment 3
[0058] The steel wire material is W18Cr4V2Co8, the diameter is Φ0.1mm, and the cryogenic treatment process is as follows:
[0059] a) Cool the steel wire from room temperature at a rate of 0.7°C / min to -196°C for 1.5 hours for the first time;
[0060] b) Raise the temperature of the steel wire after the first heat preservation to 110°C at a rate of 0.6°C / min for a second heat preservation of 1.5h;
[0061] c) Lower the temperature of the steel wire after the second heat preservation to -194°C to -196°C at a rate of 0.5°C / min for a third heat preservation of 1.6h;
[0062] d) The steel wire after the third heat preservation is raised to room temperature at a rate of 0.7°C / min.
[0063] Use steel wire after cryogenic treatment to cut silicon wafers, cutting 128m 2 After breaking, compared with the steel wire without cryogenic treatment, the cutting area is increased by 28%.
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