Power supply package and device thereof

Abstract

The embodiment of the invention discloses a power supply package which comprises a power supply energy conversion unit, wherein the power supply energy conversion unit is used for realizing conversion among different characteristic electric energies; a heat-conducting current-carrying plate is arranged on the power supply energy conversion unit, a current-carrying heat-conducting substrate is arranged under the power supply energy conversion unit; and at least one metalized welding ball is arranged below the power supply energy conversion unit. Through the heat-conducting and current-carrying plate for transferring heat upwards and the metalized welding ball for transferring heat downwards, thermal resistance which is upward from a heat point of the power supply energy conversion unit inside a power supply to a heat radiator at the top and thermal resistance which is downward from the heat point to an external printed circuit board at the bottom are remarkably reduced. The invention has the advantages of upward and downward dual-surface heat radiating capacities and high heat radiating efficiency.

Description

technical field [0001] The invention relates to the technical field of power supply, in particular to the packaging technology of a power supply module. Background technique [0002] With the increasing power and decreasing volume of equipment in the fields of telecommunications and servers, the application space of power supply is becoming more and more compact. High power density power supply has become one of the future development directions. [0003] The heat dissipation capability of the power supply package directly determines the thermal performance of the power supply, as well as the output power and efficiency of the module at high temperatures. In order to reduce the board area occupied by the power supply, heating components are usually installed in the upper and lower directions of the general power module. [0004] In the process of realizing the present invention, the inventors found that the prior art had at least the following problems: the existing structu...

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Problems solved by technology

[0004] In the process of realizing the present invention, the inventors found that the prior art had at least the following problems: the existing structure caused the difference in the heat dissipation capacity of the power supply energy conversion unit in the upper and lower directions, and because the lower components did not have corresponding radiators, the lower components The heat dissipation problem of the device becomes the heat dissipation bottleneck of the power module

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