Gripper for retaining flat components such as a silicon-based wafer in a nearly contactless way

A non-contact, chip technology, applied in the direction of electrical components, conveyor objects, semiconductor/solid-state device manufacturing, etc., can solve problems such as surface damage, permanent damage, chip deformation, etc., and achieve the effect of avoiding unintentional skewing

Inactive Publication Date: 2011-07-27
SSTREETCARA MPS MASCHENBAU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The latter case can cause problems when dropping components, especially in collection containers
It can also happen that an inherently unstable component deforms at least during transport, which can cause permanent damage and can also cause problems when lowering the component
[0004] The problem that arises particularly frequently is that when sucking the wafer, the wafer is sucked at least partially with small shocks, which can lead to surface damage
In addition, the wafer itself is thereby deformed, which can lead to permanent damage and can also lead to skewing when the wafer is lowered

Method used

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  • Gripper for retaining flat components such as a silicon-based wafer in a nearly contactless way
  • Gripper for retaining flat components such as a silicon-based wafer in a nearly contactless way
  • Gripper for retaining flat components such as a silicon-based wafer in a nearly contactless way

Examples

Experimental program
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Effect test

Embodiment Construction

[0050] Figure 1 to Figure 3 An example of an embodiment of a gripper according to the invention is shown in , which can be fastened to a robot arm or to a linear operating system. The holder comprises a support device 10 with five suction points, wherein a central suction point 12 is arranged in the center and four side suction points are respectively evenly spaced (equidistantly) around the central suction point. Suction part 14. The four side suction points 14 are likewise arranged equidistantly from one another. The central suction point 12 is connected to a first suction channel 16 , while the side suction point 14 is connected to a side suction channel 18 .

[0051] A negative pressure can be applied to the side suction channel 18 independently of the suction channel 16 . In this way, the side suction point 14 and the central suction point 12 can be controlled independently, whereby the central suction point 12 can be supplied with negative pressure even without negat...

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PUM

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Abstract

The invention relates to a gripper which is used for retaining flat components in a nearly contactless way. The gripper comprises a support device (10) which is provided with at least one suction point (12,14) capable of being applied with negative pressure. By the following features, the gripper achieves compensation for the manufacturing error on the component and/or on the suction point. The suction point (12,14) comprises a suction head (20). The support device (10) is provided with a suction head retainer (22). The suction head (20) is movable held in the suction head retainer (22) orthogonal to a plane of the support device (10).

Description

technical field [0001] The invention relates to a holder according to the preamble of claim 1 . Background technique [0002] Highly sensitive silicon-based wafers are required in the manufacture of solar cells, especially for photovoltaic devices, which are sometimes placed in single-use containers and sometimes in collection containers (up to 100 pieces) during the production process. However, since the wafers themselves are prone to bending and have very sensitive surfaces, the exchanging of wafers from one container to another must first be handled with extreme care. [0003] Grippers of this type are known which have a support device and three suction points arranged on the support device, whereby the member is sucked and held at three points. It can occur here that after the gripper has approached the component, not all suction points are directly in contact with the component, as a result of which either not all suction points are gripped or are not parallel to the h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/687
CPCB65G47/91H01L21/6838
Inventor G・凯特尔
Owner SSTREETCARA MPS MASCHENBAU
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