Electrostatic chuck comprising double buffer layer (DBL) to reduce thermal stress

Abstract

Disclosed is an electrostatic chuck (ESC) comprising a buffer layer to absorb thermal stress. The electrostatic chuck comprises: a main body having transverse holes; a base plate disposed on the upper side of said main body and including insertion holes corresponding to said transverse holes, and an electrode layer partially exposed through said insertion holes, to secure an object to be held by the electrostatic energy of said electrode layer; a terminal unit having a contact terminal connected to said electrode layer through said transverse holes and insertion holes, and insulating members for electrically insulating said contact terminal and said main body; a first buffer layer disposed at at least part of the boundary between said main body and said insulating member to block the transfer of thermal stress from said main body to said insulating members; and a second buffer layer disposed at at least part of the boundary between said main body and said base plate to block the transfer of thermal stress from said main body to said insulating members. According to the present invention, the buffer layers of the electrostatic chuck absorb thermal stress, thereby minimising cracks due to thermal stress and extending the life of the chuck.

Description

technical field [0001] Example embodiments relate to an electrostatic chuck within a processing chamber, and more particularly, to an electrostatic chuck including a double buffer layer for reducing thermal stress of the electrostatic chuck and preventing crack growth of the chuck. Background technique [0002] In general, processes for manufacturing semiconductor devices and flat panel devices such as liquid crystal display (LCD) devices include deposition processes such as chemical vapor deposition (CVD) and etching processes such as reactive ion etching processes. In the above-mentioned deposition process and etching process, substrates such as silicon wafers and glass panels need to be fastened to electrode sheets in the processing chamber to improve process reliability. The substrate is typically secured to electrode pads within the processing chamber by an electrostatic chuck (ESC). [0003] figure 1 is a cross-sectional view illustrating a conventional electrostatic...

AI Technical Summary

Problems solved by technology

As the electrostatic chuck 100 is repeatedly operated, the crack will spread to the upper portion of the substrate 102 until the entire substrate 102, and finally, the substrate 102 will be broken due to the crack.

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