Process for carrying out multiline cutting on silicon slices

A technology of multi-wire cutting and multi-wire cutting machine, which is applied in the field of emery, can solve the problems of increasing production cost and large consumption of steel wire, and achieves the effect of increasing the number of sheets, improving the utilization rate and small slot spacing

Inactive Publication Date: 2011-08-17
ZHEJIANG RONGMA ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process step consumes a lot of steel wire, which increases the production cost

Method used

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Embodiment Construction

[0007] The present invention will be further described below.

[0008] The process of multi-wire cutting silicon wafers takes the following steps:

[0009] 1. Take a pay-off wheel (also known as a wire feed wheel) with a coiled steel wire. The diameter of the steel wire is 0.120mm, pull out the steel wire, and pass it through the guide wheel group including several guide wheels one by one, and the main roller one. 1. Main roller 2. Guide wheel group 2 including several guide wheels. The take-up wheel (also known as wire return wheel) is installed on the multi-wire cutting machine, and the steel wire is wound multiple times on the main roller 1 and the main roller 2 to form a wire. Net, wherein the groove pitch of the first main roll and the second main roll is 0.330 mm to 0.340 mm.

[0010] 2. Set the multi-wire cutting machine to two-way routing, and keep the wire routing speed between 240m and 270m / min for cutting after starting up.

[0011] 3. After the steel wire is rout...

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PUM

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Abstract

The invention relates to a process for carrying out multiline cutting on silicon slices. The process comprises the following steps that firstly a steel wire is arranged on a multiline cutting machine; then the steel wire cuts the silicon slices by a bidirectional routing method at certain routing speed; when the steel wire completes routing and retracts on a take-up reel, a pay-off wheel and the take-up reel are interchanged, the diameter of the steel wire is measured, and a main roll which meets the thickness requirement of the steel wire and has a corresponding slot pitch is arranged on the multiline cutting machine again; and then the steel wire cuts the silicon slices by a unidirectional routing method at the routing speed which is 1.5 to 2.5 times of the original bidirectional routing speed. Due to the adoption of the method, in the process of carrying out multiline cutting on the silicon slices, the using amount of the used steel wire is reduced by one third and the utilization rate of the steel wire is improved. Moreover, after the bidirectional routing method is changed into the unidirectional routing method, cutting is carried out continuously. The steel wire is thinner. The slot pitch is smaller. The slice outlet number of the silicon slices can also be increased.

Description

technical field [0001] The invention relates to a process for cutting silicon wafers with multiple wires, in particular to a process for cutting silicon rods into silicon wafers by using steel wires to drive corundum in mortar. Background technique [0002] At present, in the process of cutting silicon rods into silicon wafers, the steel wire pulled out from the pay-off wheel (also known as the wire feeding wheel) that is wound with the steel wire is generally passed through the guide wheel group including several guide wheels. 1. The main roller 2. The guide wheel group including several guide wheels 2. The take-up wheel (also called the return wheel) is installed on the multi-wire cutting machine, and the steel wire is wound on the main roller 1 and the main roller 2 multiple times to form Wire net, and then according to a certain speed, adopt the method of two-way routing to cut silicon wafers, after all the steel wires just go through from the beginning to the end (curre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
Inventor 钱荣林聂在涌
Owner ZHEJIANG RONGMA ELECTRONICS TECH
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