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Method for preparing light emitting diode (LED) packaging module

A LED packaging and LED chip technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as complex process flow, LED lighting promotion restrictions, high cost of LED packaging modules, etc., to achieve simple assembly methods and low cost low effect

Inactive Publication Date: 2011-08-24
DONGGUAN WANFENG NANOMETER MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Complicated process flow leads to high cost of LED packaging modules, and extends to terminal lamps, limiting the promotion of LED lighting

Method used

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  • Method for preparing light emitting diode (LED) packaging module
  • Method for preparing light emitting diode (LED) packaging module
  • Method for preparing light emitting diode (LED) packaging module

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Embodiment Construction

[0027] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0028] refer to figure 1 , 3 , is the LED packaging module prepared in the first embodiment of the present invention, including LED chips 103, and also includes copper pillars 101, the copper pillars 101 are pierced through the plastic shell 104, and the LED chips 103 are arranged on the ends of the upper surface of the copper pillars 101, The lower end surface of the copper column 101 is exposed from the lower surface of the plastic shell 104, the LED chip 103 is exposed from the upper surface of the plastic shell 104, the electrode 105 is sandwiched in the plastic shell 104, and the inner end of the electrode 105 is also exposed from the upper surface of the plastic shell 104, The LED chip 103 is connected to the inner end of the electrode 105 through a gold wire 106 ; an optical cup 108 is provided on the front of the plastic case 104 . In this embodimen...

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Abstract

The invention relates to a semiconductor illumination technology, in particular to a method for preparing a light emitting diode (LED) packaging module. The method for preparing the LED packaging module is characterized by comprising the following steps of: 10, stamping electrode plates, wherein a bracket for forming a circuit is reserved between the electrode plates; 20, performing injection machining of a plastic shell; 30, providing a copper pillar, and pressing the copper pillar into the plastic shell; 40, providing an LED chip, and performing die bond on the top surface of the copper pillar; and 50, welding a gold thread, and connecting the chip with the electrode. The method for preparing the LED packaging module is simple in process.

Description

technical field [0001] The invention relates to semiconductor lighting technology, in particular to a method for preparing an LED encapsulation module. Background technique [0002] LED lights have the characteristics of long life and power saving, and are more and more widely used in the field of lighting. Most of the traditional methods of manufacturing LED packaging modules are based on substrate packaging, which requires an insulating adhesive layer and a circuit layer, and the preparation process is very complicated. [0003] For example, the Chinese patent document CN101691909A disclosed on April 7, 2010 a method for preparing an LED packaging module, the LED packaging module includes a substrate, the substrate has a wiring surface, and the wiring surface includes a circuit part; the method includes a circuit part manufacturing process, and is characterized in that , the production process of the circuit part comprises the following steps: (1) silk screen printing hea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L25/075H01L33/48H01L33/50H01L33/62H01L33/58
CPCH01L2224/48091H01L2224/73265H01L2924/00014
Inventor 李金明
Owner DONGGUAN WANFENG NANOMETER MATERIALS