Circuit board resin film evener and using method thereof

Abstract

The invention discloses a circuit board resin film evener machine and a using method thereof. The circuit board resin film evener machine comprises a film feeding mechanism, a film receiving mechanism, a compressing mechanism, a guide material mechanism, a transmission mechanism and a rack. In the invention, redundant resin on a circuit board is stuck and removed by a pressed film, the raw material is simple, and the cost is low. The circuit board resin film evener has a simple structure; a fastener fixed bracket is designed, so that the assembly and the disassembly of the new pressed film and old pressed film are convenient, and the production efficiency can be improved; by the design of a pressure tight end and an elastic fixed bracket, the pressed film can keep level and compact all the time to be completed fit with the circuit board, and the redundant resin on the circuit board can be effectively stuck and removed; the transmission mechanism with a plurality of gears is driven by a motor, so that rollers for compressing can keep the same linear speed, so that the pressed film can keep level and compact all the time; as the electric heating filaments in the compressing rollers and the coder in the compressing gears are arranged, the compressing temperature can be controlled, the resin in a through hole can be in a half-curing state all the time, simultaneously; and the rotating speed of the motor can be adjusted along the changes of the diameter of a film feeding roller, so that the pressed film can be fitted and separated at constant speed.

Description

technical field [0001] The invention relates to a circuit board leveling machine, in particular to a circuit board resin lamination leveling machine and a use method thereof. Background technique [0002] Existing circuit boards generally use resin or glass cloth as the substrate, and circuit layers are respectively arranged on both sides of the substrate. In order to ensure heat dissipation of the circuit board, via holes are provided on the circuit board. In the production of multilayer circuit boards, it is necessary to bond the multilayer circuit boards with resin, that is, firstly fill the via holes with resin, and then press another circuit board and resin layer into one. When the via hole is filled with resin, due to the surface tension, the resin in the via hole is in a raised state. When it is pressed with another layer of resin layer and the circuit board, it will cause a large amount of resin in the via hole. Local deformation of the circuit board. When the...

AI Technical Summary

Problems solved by technology

When the via hole is filled with resin, due to the surface tension, the resin in the via hole is in a raised state. When it is pressed with another layer of resin layer and the circuit board, it will cause a large amount of resin in the via hole. Deform the circuit board locally

When the circuit board heats up, the deformation here is large, which will cause the circuit board to delaminate or explode

[0003] The traditional process is to use a grinding tool to polish off the raised resin after the resin in the via hole is cured, and the grinding will make the raised resin squeeze deep into the guide hole, resulting in deformation of the circuit board. The resin at the via hole is smooth and cannot be completely combined with the resin layer after lamination, and it is easy to separate when heated, causing the circuit board to delaminate

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