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Crystal immersing and cutting method

A cutting method and cutting fluid technology, which can be applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problem of wasteful production cost of cutting fluid, and achieve the effect of ensuring cutting quality, solving low efficiency and high utilization rate.

Active Publication Date: 2011-09-07
海宁市日进科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a crystal immersion cutting method to solve the high production cost caused by a large amount of waste of cutting fluid in the cutting process, and to completely solve the problem of free sand cutting. efficiency issues

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Embodiment Construction

[0014] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0015] The present invention provides a crystal immersion cutting method, which is applied to multi-wire cutting equipment for cutting crystalline silicon ingots. System (not shown), in a specific embodiment, the multi-wire cutting system usually includes at least: a frame, a wire storage drum arranged on the frame for winding wire, for driving the storage Servo motors for high-speed operation of the cutting wire, multiple wire wheels...

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Abstract

The invention provides a crystal immersing and cutting method which is applied in a multi-wire cutting device for cutting a crystal silicon ingot. The multi-wire cutting device at least comprises a cutting table for carrying a crystal silicon ingot to be cut and a multi-wire cutting system for running cutting wires, and the method comprises the following steps: firstly setting a liquid containing groove on the cutting table of the multi-wire cutting device; secondly, placing the crystal silicon ingot to be cut in the liquid containing groove; then injecting a cutting liquid into the liquid containing groove, and immersing the crystal silicon ingot to be cut in the cutting liquid; and further running the cutting wires at a high speed so that the cutting wires oppress the liquid containing groove and are immersed in the crystal silicon ingot to be cut in the cutting liquid so as to further enable the cutting wires to cut the crystal silicon ingot to be cut in the cutting liquid while cutting the side wall of the liquid containing groove and further enable the cutting liquid to flow out from a gap on the cut side wall of the liquid containing groove during the cutting process so as to be conductive to circulation. By adopting the method, the problem that cutting sand which is brought into a cutting region during the cutting process is rare, and the cutting efficiency is further greatly improved.

Description

technical field [0001] The invention relates to a multi-wire cutting technology, in particular to a crystal immersion cutting method applied in a multi-wire cutting device to increase the amount of sand in the cutting fluid to improve production efficiency. Background technique [0002] Multi-wire cutting technology is a relatively advanced crystalline silicon processing technology in the world at present. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub against hard and brittle materials such as semiconductors to achieve the cutting effect. Compared with the traditional saw blade, grinding wheel and inner circle cutting, the multi-wire cutting technology has the advantages of high efficiency, high productivity and high precision. The multi-wire cutting technology is currently the most widely used cutting technology for hard and brittle materials such as semiconductors. [0003] Existing multi-wire cutting eq...

Claims

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Application Information

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IPC IPC(8): B28D5/04
Inventor 卢建伟
Owner 海宁市日进科技有限公司