Light emitting diode packaging element and manufacture method thereof
A technology for light-emitting diodes and packaging components, which is used in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices.
Inactive Publication Date: 2011-09-21
EVERLIGHT ELECTRONICS
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Problems solved by technology
[0008] However, in this manufacturing method, since it is difficult for the stamper to cover the cured fluorescent material layer evenly and uniformly, it is easy to generate slurry overflow in the stage of pouring the slurry and cover the upper surface of the fluorescent material layer. The problem of reducing the light output efficiency of LEDs is caused. In severe cases, other processing operations are required to remove the flash covering the upper surface of the fluorescent material layer
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[0025] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. It should be readily appreciated, however, that the embodiments of the invention provide many suitable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the making and use of the present invention in specific ways, and are not intended to limit the scope of the present invention.
[0026] Please refer to Figure 1A to Figure 1I , which shows a schematic cross-sectional view of a method for manufacturing a light emitting diode package component according to an embodiment of the present invention. Please refer to Figure 1A , providing a packaging substrate 102, the packaging substrate has good heat dissipation, and can be a ceramic substrate or other materials with better heat dissipation. Afterwards, a plurality of LED chips 104 are placed on the packa...
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The invention discloses a light emitting diode packaging element and a manufacture method thereof. The manufacture method comprises the following steps of: covering a light transmission sealing body on a plurality of LED chips above a substrate so as to form a plurality of LED packaging element semi-finished products; after attaching the LED packaging element semi-finished products on one side ofa flexible back adhesive film, and under the condition of not cutting the flexible back adhesive film, cutting the LED packaging element semi-finished products in an established size; after attachinga flexible protective film on one sides of the cut LED packaging element semi-finished products, opposite to the flexible back adhesive film, and immersing the LED packaging element semi-finished products in slurry so that the slurry covers the positions of the LED packaging element semi-finished products, which are not attached by the flexible protective film and the flexible back adhesive film;and after taking out the LED packaging element semi-finished products from the slurry, drying the LED packaging element semi-finished products. The invention further discloses an LED packaging element which is manufactured by the manufacture method.
Description
technical field [0001] The present invention relates to a light-emitting diode packaging component and a manufacturing method thereof, in particular to a method for forming a low-thickness wall part on the surface of a semi-finished side wall of a surface-mounted light-emitting diode component. Background technique [0002] In recent years, portable electronic products such as digital cameras, camera phones or mobile communication devices have begun to use light-emitting diodes (LEDs) as light-emitting components such as backlight components or flashlights for the convenience of portability and the gradual rise of environmental protection awareness. Because the volume of cameras and mobile phones must be made smaller and smaller, the internal components are also reduced accordingly, so the miniaturization of light-emitting diodes has become an inevitable trend. [0003] Prior art proposes as Figure 4 A light emitting diode package component 400 is shown. The LED chips 412 ...
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IPC IPC(8): H01L21/50H01L21/56H01L21/68H01L25/13H01L33/52
CPCH01L24/97H01L2224/48091H01L2224/48247H01L2924/12041H01L2924/15787H01L2924/181H01L2924/00014H01L2924/00
Inventor 蔡尚勋
Owner EVERLIGHT ELECTRONICS