Leadframe circuit and method therefor

Abstract

An integrated circuit leadframe device supports various chip arrangements. As consistent with various embodiments, a leadframe includes a plurality of banks of conductive integrated circuit chip connectors. Each bank has a plurality of conductive strips respectively having an end portion, the end portions of each of the strips in the bank being substantially parallel to one another and arranged at an oblique angle to end portions of strips in at least one of the other banks. Each of the end portions has a tip extending to an interior portion of the leadframe device and separated from the other tips by a gap. A fastening material is arranged on at least some of the conductive strips and configured to fasten an integrated circuit chip to the conductive strips

Description

[0001] This patent document is based on 35 U.S.C. §119 claiming the benefit of U.S. Provisional Patent Application Serial No. 61 / 287,902, filed December 18, 2009, entitled "LEADFRAME CIRCUIT AND METHOD THEREFOR," the entire contents of which are hereby incorporated by reference. technical field [0002] The present invention relates generally to circuits, and more particularly to leadframes and leadframe circuits. Background technique [0003] Lead frames are used to support and connect integrated circuits and other semiconductor chips. Typically, the chip is secured to a leadframe and the contacts on the chip are wire bonded to leads or connections in the leadframe to make (electrical) contact with the leadframe contacts at the outside of the leadframe. These leadframe contacts thus enable the electrical connection of the chip to other devices. [0004] Unfortunately, many leadframes are limited to specific designs in application. When a lead frame of a different design i...

AI Technical Summary

Problems solved by technology

These changes are costly, time-consuming, and often detrimental to the design, implementation, and use of semiconductor and integrated circuit devices

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