Radiator of LED (light emitting diode)

A light-emitting diode and heat sink technology, applied in the field of light-emitting diode heat sinks, can solve problems such as the decline in heat sink efficiency, the accumulation of dust on the back, and the hindrance of heat exchange between the heat sink and air, so as to improve heat dissipation efficiency and ensure luminous efficiency and normal lifespan

Inactive Publication Date: 2011-09-28
泰州赛龙电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat sink with this structure accumulates dust very much on the ridge, especially the ridge of the heat sink is more likely to accumulate dust
Accumulated dust hinders the heat exchange between the radiator and the air, affecting heat dissipation
In open spaces (such as street lamps, square lighting fixtures, etc.), especially in the environment with a lot of sand and dust in the north, the surface of the radiator is very dusty, which leads to a sharp drop in the efficiency of the radiator, heat accumulation of LED chips, temperature rise, and light decay. , which greatly shortens the service life of the LED

Method used

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  • Radiator of LED (light emitting diode)
  • Radiator of LED (light emitting diode)
  • Radiator of LED (light emitting diode)

Examples

Experimental program
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Effect test

Embodiment 1

[0013] An LED light-emitting diode radiator, including a heat sink 1 and fins 2, the heat sink 1 is a hollow cylinder structure, the fins 2 are arranged longitudinally along the heat sink 1 cylinder, and the heat sink 1 It is structurally integrated with the fin 2, the length of the fin 2 is greater than the height of the cylinder of the heat sink 1, the side of the fin 2 away from the heat sink 1 is a straight line, and the other side has a slanted line, The slanted side of the fin 2 forms an open hollow portion 3, and the fin 2 is exposed on the end surface of the heat sink 1 and is also provided with a cooling fan 4, and the fan blade 5 of the cooling fan 4 is provided with In the hollow 3 formed by the fin 2 .

Embodiment 2

[0015] An LED light-emitting diode radiator, including a heat sink 1 and fins 2, the heat sink 1 is a hollow cylinder structure, the fins 2 are arranged longitudinally along the heat sink 1 cylinder, and the heat sink 1 It is integral with the fin 2 in structure, the length of the fin 2 is greater than the height of the heat sink 1 cylinder, the side of the fin 2 away from the heat sink 1 is a straight line, and the other side has a curve, so The curved side of the fin 2 above forms an open hollow part 3, and the fin 2 is exposed on the end surface of the heat sink 1 and is also provided with a cooling fan 4, and the fan blade 5 of the cooling fan 4 is arranged on the wing Inside the hollow portion 3 formed by the sheet 2.

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Abstract

The invention discloses a radiator of an LED (light emitting diode). The radiator comprises a heat sink and a rib, wherein the heat sink is of a hollow cylindrical structure; the rib is arranged on the outer side wall of the heat sink; the heat sink and the rib are integrated structurally; the rib is arranged longitudinally along a sink cylinder; the length of the rib is greater than the height of the heat sink cylinder; and the end surface of the rib exposed to the heat sink is also provided with a radiating fan. The back part of the heat sink of the radiator for the LED is difficult to collect dust, and the radiation efficiency is improved effectively.

Description

Technical field: [0001] The invention relates to a light-emitting diode (LED) radiator. Background technique: [0002] When semiconductor lighting enters the field of practical high-power lighting fixtures, the biggest constraint is conduction and heat dissipation. At present, in order to meet the lighting design requirements of semiconductor lighting lamps, multiple high-power chips must be installed in the lamp body. Sometimes multiple light sources are set in a lamp, and each single light source is packaged by multiple high-power chips. The problem caused by multiple high-power chip structures is that the junction temperature of the LED rises, which affects the luminous rate and life of the LED, and even burns the LED chip. Prior art heat sinks include heat sinks and fins. Both the heat sink and the spine of the airfoil are planar. In actual use, the substrate on which the LED chip is installed is fixed on the belly of the radiator, and the ridge of the radiator is pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/02H01L33/64F21Y101/02F21V29/67F21V29/71F21Y115/10
Inventor 吴加杰
Owner 泰州赛龙电子有限公司
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