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Sealant or filler for electrical and electronic components, and electrical and electronic components

一种电子部件、密封剂的技术，应用在电气元件、电固体器件、半导体/固态器件零部件等方向，能够解决固化不完全、有损密封或填充部件可靠性、固化体硬度不足等问题，达到改善可靠性的效果

Inactive Publication Date: 2011-09-28
DOW CORNING TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the curing of the aforementioned composition at room temperature will result in either incomplete curing or insufficient hardness of the cured body produced.
In addition, reliability tests of electrical and electronic components sealed or filled with the aforementioned compositions have shown that the hardness of the cured body changes over time, thereby impairing the reliability of the sealed or filled components

Method used

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  • Sealant or filler for electrical and electronic components, and electrical and electronic components
  • Sealant or filler for electrical and electronic components, and electrical and electronic components

Examples

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Embodiment

[0035] The inventive sealant or filler for electrical and electronic components and components themselves will now be further described in more detail with reference to application and comparative examples. In these examples, the individual properties have values ​​measured at 25°C. In addition, the properties of this sealant or filler for electric and electronic parts and its cured body were measured by the methods described below.

[0036] [viscosity]

[0037] A two-liquid type organopolysiloxane composition curable by a hydrosilylation reaction was prepared from Liquid A and Liquid B shown in Table 1. The viscosity of the composition was measured directly after the liquids A and B were mixed using a rotational viscometer (Digital Viscometer DVH-B-411, Tokimec Co., Ltd.). This viscosity was taken as the initial viscosity. After that, the viscosity was measured at 25°C for a predetermined period of time. More specifically, the times were measured when the viscosity increa...

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Abstract

A sealant or filler of the invention for electrical and electronic components comprises a two or more liquid type organopolysiloxane composition curable by a hydrosilylation reaction, the viscosity of the composition being doubled at room temperature during 10 min. or more from the initial value obtained directly after mixing all the components, and being increased at room temperature from 5-fold to 10-fold of the initial viscosity within another 10 min. The sealant or filler for electrical and electronic components can be cured to a sufficient degree at room temperature and improve reliability of the sealed or filled components.

Description

technical field [0001] The present invention relates to sealants or fillers for electrical and electronic components, and to electrical and electronic components sealed or filled, respectively, with the aforementioned sealants or fillers. Background technique [0002] It is known in the art to seal or fill electrical and electronic components with organopolysiloxane compositions curable by a hydrosilylation reaction. Such compositions can, for example, be exemplified by compositions comprising branched organopolysiloxanes with vinyl groups, linear organopolysiloxanes with silicon-bonded hydrogen atoms, and hydrosilylated A composition of a reaction catalyst {see Japanese Unexamined Patent Application Publication (hereinafter referred to as "Kokai") S48-17847}; comprising a branched chain organopolysiloxane having a vinyl group, a polysiloxane having a silicon-bonded hydrogen atom A composition of an organopolysiloxane and a hydrosilylation reaction catalyst (see Kokai S58-7...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04H01L21/56
CPCH01L23/296C08G77/20C08G77/12C08L83/04H01L2924/0002C08L83/00H01L2924/00
Inventor 锅田祥子中吉和己
Owner DOW CORNING TORAY CO LTD
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