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Method for uniformly and chemically gold-plating ITO wiring on capacitive touch screen

A capacitive touch screen, chemical gold plating technology, applied in liquid chemical plating, electrical digital data processing, metal material coating technology and other directions, can solve the problems of gold plating falling off, inconsistent gold plating thickness, time difference, etc., to achieve uniform gold plating thickness and transmission. good signal ability

Active Publication Date: 2012-12-26
HUZHOU SHENGXI ELECTRONICS & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual chemical gold plating process, the gold plating precipitation time will produce a time difference according to the area of ​​each trace, resulting in a thinner part of the gold plating film with a slower gold plating precipitation time, which is easy to cause gold plating to fall off. The situation may lead to the problem that the wires cannot be plated with gold, and the gold plating thickness of the wires is inconsistent, which will directly lead to the poor stability of the touch screen product and the ability to transmit signals.

Method used

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  • Method for uniformly and chemically gold-plating ITO wiring on capacitive touch screen
  • Method for uniformly and chemically gold-plating ITO wiring on capacitive touch screen
  • Method for uniformly and chemically gold-plating ITO wiring on capacitive touch screen

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Effect test

specific Embodiment 1

[0027] Specific embodiment one, see figure 1 , figure 2 : the original part to be gilded 1 (see figure 1 ) The length of the single trace 3 is thin, and now the part to be gold-plated is thickened (see 1 figure 2 ) of a single trace 3, to ensure that the area ratio of the trace area of ​​each trace to the single X / or Y direction sensing electrode 4 connected to the corresponding non-gold-plated part 2 is greater than 1%; after that, through chemical nickel plating, chemical The gold-plating process gold-plates the traces of the gold-plated part 1 of each touch glass, and the thickened part is located at the connecting terminal line part 7 between a single trace 3 and a single X / or Y-direction sensing electrode 4 .

specific Embodiment 2

[0028] Specific embodiment two, see image 3 , Figure 4 , Figure 5 , Figure 6 : Extend the length of a single trace 3 of the part 1 to be gold-plated, and ensure that the ratio of the trace area of ​​each trace 3 to the area of ​​the single X / or Y-direction sensing electrode 4 connected to the corresponding non-gold-plated part 2 is greater than 1 %; Specifically, to extend the length of the chamfered transition area of ​​the single trace 3 of the part to be gold-plated 1, the Figure 4 The rounded transition in 5 becomes Figure 6 Angled slash transitions in 6.

specific Embodiment 3

[0029] Specific embodiment three, see Figure 7 , Figure 8 : Auxiliary wiring 8 is etched in the non-touch screen area of ​​the ITO glass, and the area ratio of the wiring 3 of the part to be gold-plated 1 and the corresponding non-gold-plated part 2 connected to the single X / or Y-direction sensing electrode 4 does not exceed 1%. The trace 3 is connected to the auxiliary trace 8, and the total area of ​​the connected trace 3 and the auxiliary trace 8 is greater than 1% of the area of ​​the single X / or Y direction sensing electrode 4 connected to the corresponding non-gold-plated part 2, After the electroless nickel plating and electroless gold plating are completed, the area of ​​the auxiliary wiring 8 is cut off.

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Abstract

The invention provides a method for uniformly and chemically gold-plating ITO (Indium Tin Oxide) wiring on a capacitive touch screen, which enables the gold-plating thickness of each wiring needing gold-plating and being arranged on the ITO glass to be uniform and the product stability and signal transmission capability of the touch screen to be good. The capacitive touch screen comprises a part to be plated and a part not to be plated of the ITO glass; the part to be plated is etched with the wirings, the part not to be plated is covered with a gold-plating protective film, sensing electrodes uniformly distributed in the part not to be plated at an X / Y direction are connected with an external structure by the corresponding wirings, and then the wiring of each touch glass is plated by adopting a chemical nickel plating process and a chemical gold plating process. The ratio of the area of the wirings which are mutually connected in the part to be plated to the area of the signal sensing electrodes at the X / Y direction in the part not to be plated is greater than 1%.

Description

technical field [0001] The invention relates to the technical field of gold plating on the surface of a capacitive touch screen, in particular to a method for evenly chemically gold-plating ITO wiring on a capacitive touch screen. Background technique [0002] The existing capacitive touch screen is gold-plated by chemical gold-plating method. For the chemical gold-plating method, please refer to the application number: 201010188452.9, the application date: 2010.06.01, the name: a method for chemical gold-plating on the surface of the capacitive touch screen, and the publication number: According to the patent application of CN101845625A, in the actual chemical gold plating process, various wires that need to be plated with gold are arranged on the ITO glass. It is possible to make the total area of ​​the wiring smaller, thereby saving gold-plated raw materials, thereby saving costs. However, in the actual chemical gold plating process, the gold plating precipitation ti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/044C23C18/42
Inventor 西正秀
Owner HUZHOU SHENGXI ELECTRONICS & TECH
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