34results about How to "Strong signal transmission ability" patented technology

The invention discloses a printed circuit board. The printed circuit board comprises a first layer and a second layer, wherein the first layer is provided with a pair of differential signal lines; the second layer comprises a cross groove; with respect to the two differential signal lines, the widths of the portions which are not positioned above the cross groove are less than those of the portions which are positioned above the cross groove; and with respect to the two differential signal lines, the space between the portions which are not positioned above the cross groove are greater than that between the portions which are positioned above the cross groove. The printed circuit board avoids the discontinuity of impedance by increasing the line widths of the portions of the differential signal lines positioned above the cross groove, so the signal transmission capacity of the differential signal lines positioned above the cross groove can be improved well.

The invention provides a compact MIMO antenna and a communication device comprising the same. The compact MIMO antenna comprises a neutralization line and two antenna elements, namely a first antennaelement and a second antenna element. The first antenna unit and the second antenna unit are connected through a neutralization line, and the neutralization line includes at least one L-shaped bent portion; the antenna unit includes a trapezoidal radiation body, a ground point connected to the GND, and a feed point for transmitting a signal. The long bottom edge of the trapezoidal radiation body is far away from the GND setting; The long bevel edge of the trapezoidal radiation body is arranged close to the neutralization line; The first end of the long bottom side of the trapezoidal radiationbody is connected to the neutralization line, and the second end of the long bottom side of the trapezoidal radiation body extends with a radiation end, the end point of the radiation end is close tothe GND and is provided with a gap with the GND. The invention meets the requirements of small size, high isolation, simplified structure, high signal transmission performance and good anti-interference performance of the MIMO antenna.

The invention relates to the field of pin piece manufacturing, in particular to a novel making process of a cylindrical pin piece of a digital transmission connection pin. The process comprises the following steps of: (a) selecting materials: selecting a copper strip with width of 18-27.5 mm and thickness of 0.16-0.22 mm, and placing the copper strip on a swinging feeding device; and (b) high speed precision stamping and deep drawing: feeding the copper strip meeting specifications to a deep drawing progressive die by the swinging feeding device; carrying out continuous deep drawing on the copper strip until an outer pipe finished product meeting the specifications are deeply drawn by a multi-station continuous die. The novel making process provided by the invention has the advantages as follows: the production efficiency is greatly increased, the direct production cost is reduced and high accuracy and stable quality of a product are guaranteed; good mechanical strength and transmission performance are also achieved; it is proved by test that parameters of the product, such as mechanical strength, anti-interference property and the like, all meet specifications and standards in the industry, and compared with a copper rod turned piece, the product has the advantages of more stable performance and strong signal transmission effect.

The invention relates to a communication cable special-purposed cable sheath material, and relates to the technical field of cable processing. The material is prepared from the raw materials of, by weight, 80-90 parts of linear low-density polyethylene, 10-14 parts of carbon black masterbatch, 8-10 parts of benzoyl peroxide, 8-10 parts of stearic acid, 15-25 parts of decabromodiphenyl ether, 15-25 parts of phosphite, 3-5 parts of a lubricant, and 4-6 parts of an antioxidant. The process flow is simple; raw material formulation is reasonable; and a sheath raw material is provided for communication cables. The material has the advantages of high insulation performance, high resistivity, low dielectric loss, strong signal transmission performance, and better application effect. With the material, communication cable reasonable application is ensured.

A low-cost system for wireless, bi-directional transformation of electric signals over a capacitive interface between a host unit and a guest unit is provided. The system allows a high impedance in the circuitry of the guest unit to obtain a good signal transfer ability in conditions of poor dieelectric materials, poor conductivity in the contact pads and relatively large gaps between the contact pads. The capacitive interface comprises a respective first (A1; B1), second (A2; B2) and third (A3; B3) conductive area in the host and guest units (10,40). The first conductive area (A1) of the host unit is connected to a self-tuning frequency generating resonant circuit (16) in the host unit (10) for obtaining high gain of signals transmitted to the guest unit (40). The second and third conductive areas (A2, A3) of the host unit are connected to an impedance circuit (30) in the host unit for receiving signals from the guest unit. The first and second conductive areas (B1, B2) of the guest unit are further connected to an impedance circuit (44) in the guest unit for receiving signals from the host unit. In a preferred embodiment, the first and third conductive areas (B1, B3) of the guest unit are also galvanically interconnected.

The invention discloses an outdoor device for wireless network coverage in a park, which includes a housing, an upper cover is connected to the housing, and a plurality of fixing buckles are connected to the housing and the upper cover, and the fixing buckles are arranged symmetrically on both sides of the housing. There is a hinge between the housing and the upper cover, a signal inlet is provided at the center of the lower bottom of the housing, a hook is connected to a side wall of the housing away from the hinge, and a wireless antenna is connected to the upper top of the housing; the present invention One of the campus wireless network coverage users outdoor equipment, which uses a vein-shaped antenna, which has the characteristics of small size and stable signal transmission. Through the setting of the vein-shaped bracket, it is easy to disperse the wireless signal, so that the wireless network can be transmitted effectively. The range is wider; through the setting of the lightning rod, the antenna is not easy to suffer from lightning strikes or other damages during use; through the setting of double filters, it is easy to filter the signal impurities in the wireless network signal, making the transmission signal better. Easy for users to use.

The invention relates to the electric connector technical field and relates to a flat cable connecting terminal and a manufacturing method thereof. The wiring end of the terminal is provided with an electric conduction fixing connection portion; the electric conduction fixing connection portion is connected with a flat cable and is in electric conduction with the flat cable; a reinforcing wire connection portion extends out from the electric conduction fixing connection portion towards the extension direction of the flat cable; the reinforcing wire connection portion is fixedly connected with the flat cable; and the reinforcing wire connection portion and the terminal are fabricated integrally. A material belt is pierced, so that the terminals can be molded in the material belt in a split manner; the wiring ends of adjacent terminals on the material belt are molded in a batched manner; when the wiring end of a certain terminal is molded, the adjacent terminal of the terminal moves away, so that the wiring end of the terminal can be thinned, punched and molded; and the wiring ends of the terminals are molded alternately, so that rows of flat cable connecting terminals can be obtained through shaping. The manufacturing method is simple. The reinforcing wire connecting portion is additionally adopted and is fixedly connected with the flat cable, and therefore, the strength of the connection of the flat cable and the connecting terminal can be improved, the excellent signal transmission capacity of the flat cable can be ensured, and the service life of the flat cable can be prolonged.

The present invention relates to the technical field of wire materials and particularly relates to a wire component and an electronic device. The wire component includes a conductive member transmission wire and a conductive adhesive, the conductive member is provided with a strip-shaped slot, and the transmission wire is embedded in the slot. The transmission wire includes a base material covering an opening of the slot, a signal wire located in the base material and first and second ground wires disposed on two sides of the base material, the first ground wire is exposed outside the openingof the slot, the first ground wire is electrically and fixedly connected to the conductive member, and the second ground wire is fixedly connected to a bottom of the slot through the conductive adhesive. The electronic device includes the above wire component, and the conductive member of the wire component is a metal frame of the electronic device. The wire component and the electronic device ofthe present invention have the advantages of small volume and good signal transmission performance.

The invention provides a method for uniformly and chemically gold-plating ITO (Indium Tin Oxide) wiring on a capacitive touch screen, which enables the gold-plating thickness of each wiring needing gold-plating and being arranged on the ITO glass to be uniform and the product stability and signal transmission capability of the touch screen to be good. The capacitive touch screen comprises a part to be plated and a part not to be plated of the ITO glass; the part to be plated is etched with the wirings, the part not to be plated is covered with a gold-plating protective film, sensing electrodes uniformly distributed in the part not to be plated at an X / Y direction are connected with an external structure by the corresponding wirings, and then the wiring of each touch glass is plated by adopting a chemical nickel plating process and a chemical gold plating process. The ratio of the area of the wirings which are mutually connected in the part to be plated to the area of the signal sensing electrodes at the X / Y direction in the part not to be plated is greater than 1%.

This invention relates to an electric connector and an assembling method, in which, the connector is composed of a signal module and a metal sleeving wrapping on them, the signal module includes a central terminal, metal tube and a plastic body with a collecting cavity formed on the front, the central terminal has a connecting part extending to back of the body, an end-to-end part extending into the collecting cavity, the metal tube is inbuit in the plastic body and its end-to-end part extends to the collecting cavity of the body. The assembling process includes ejection and formation and assembling the shell, the first step is to put the central terminal, metal shell and the body to injection moulding and second is to sleeve the metal sleeving on the signal module.

The invention discloses an electrical connector for electrically connecting a chip module, comprising: a circuit board, a plurality of conductive pads are arranged on the upper surface, a plurality of terminals, the terminals have a welding part, the The welding part is laser welded to the conductive pad, so that the welding part and the conductive pad are melted to form a molten pool, and a solder paste is provided around the molten pool, and the solder paste connects the soldered part to the conductive pad. The conductive gasket is welded, and the material of the welding part and the material of the conductive gasket are fused together by laser, so the strength of the welding part welded to the conductive gasket is very stable. When the chip module is pressed down During the terminal, the welding part will not be separated from the conductive pad, so as to ensure a good electrical connection between the electrical connector and the circuit board, and solder paste is provided around the molten pool, which increases the contact between the welding part and the conductive pad The area reduces the electrical impedance during signal transmission, thereby providing good signal transmission performance between the chip module and the circuit board.

The invention relates to a multilayer PCB circuit board, and the total layer number is an even number which is not smaller than 8. The multilayer PCB circuit board comprises a base board, and the base board comprises a first power supply layer and a first grounding layer which are vertically arranged; multiple second grounding layers and multiple second power supply layers are sequentially distributed on the upper surface of the first power supply layer from bottom to top in a staggered mode, and multiple third power supply layers and multiple third grounding layers are sequentially distributed on the lower surface of the first grounding layer from top to bottom in a staggered mode; a signal layer is arranged between the first power supply layer and the second grounding layer adjacent to the first power supply layer, between each second grounding layer and the corresponding second power supply layer adjacent to the second grounding layer, between the first grounding layer and the third power supply layer adjacent to the first grounding layer, between each third power supply layer and the corresponding third grounding layer adjacent to the third power supply layer, on the upper surface of the uppermost layer and on the lower surface of the lowermost layer. The multilayer PCB circuit board is reasonable in design, excellent in electromagnetic compatibility and high in anti-electromagnetic interference and signal transmission capacity, all the properties are more balanced, and the properties of electronic products are greatly promoted.

A method for forming an SRAM unit, comprising: forming: first, second, third, fourth, fifth, and sixth fins; a first grid across the first, second, and third fins; across the first, second The second gate of the fin, the first and second fins between the first and second gates are the first drain; the third gate across the fourth, fifth and sixth fins is across the fifth, The fourth gate of six fins, the fifth and sixth fins between the third and fourth gates are the second drain; the fifth source and third drain of the third fins on both sides of the first gate ; the sixth source and the fourth drain of the fourth fin on both sides of the third gate; forming an interlayer dielectric layer; the first patterning forms a first trench, across the first and second fins of the first drain part, the third fin of the third drain; the second patterning forms a second trench, across the fifth and sixth fins of the second drain, and the fourth fin of the fourth drain; in the first trench The groove forms the first metal layer, and the second groove forms the second metal layer. SRAM cells are realized technologically.

The invention provides a touch electrode structure, a touch substrate and a preparation method thereof, a display panel, and a display device, belonging to the field of touch technology, which can at least partly solve the uneven signal at different positions of the touch electrode in the existing touch substrate The problem. The touch electrode structure of the present invention includes: a touch electrode made of transparent conductive material; a signal line corresponding to the touch electrode, at least one insulating layer is arranged between the signal line and the touch electrode; A conductive structure, the auxiliary conductive structure is connected to the touch electrode at multiple positions; and a first insulating layer is provided between the auxiliary conductive structure and the signal line, and the touch sensor is connected to the first via hole in the first insulating layer. The signal line corresponding to the electrode is connected.