Electrical connector and assembly method thereof

A technology of electrical connectors and assembly methods, which is applied in the direction of connection, structural connection of printed circuits, printed circuits connected with non-printed electrical components, etc., which can solve tin cracks and affect the electrical connection between electrical connectors and circuit boards, etc. question

Active Publication Date: 2021-08-20
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the chip module presses down on the contact portion of the terminal, the soldered portion tends to move upwards. Due to the weak strength of solder paste soldering, it is easy to cause tin cracks, which in turn affects the electrical connection between the electrical connector and the circuit board.

Method used

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  • Electrical connector and assembly method thereof
  • Electrical connector and assembly method thereof
  • Electrical connector and assembly method thereof

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Embodiment Construction

[0026] In order to facilitate a better understanding of the content of the present invention, the present invention will now be further described with reference to the accompanying drawings and specific embodiments.

[0027] like figure 1 , image 3 As shown, as the best embodiment, the electrical connector 100 of the present invention is used to electrically connect a chip module 7 to a main board 8, and the electrical connector 100 includes a circuit board 1, a plurality of terminals 3 soldered to The circuit board 1 and a plurality of fixing members 2 are fixed on the circuit board 1 .

[0028] like figure 1 , image 3 As shown, the circuit board 1 is provided with an opposite upper surface 11 and a lower surface 12 and a plurality of first through holes 13 passing through the upper surface 11 and the lower surface 12, and the upper surface 11 is provided with a plurality of first through holes 13. The conductive pad 111 is provided with a plurality of solders 6 on the ...

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PUM

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Abstract

The invention discloses an electrical connector for electrically connecting a chip module, comprising: a circuit board, a plurality of conductive pads are arranged on the upper surface, a plurality of terminals, the terminals have a welding part, the The welding part is laser welded to the conductive pad, so that the welding part and the conductive pad are melted to form a molten pool, and a solder paste is provided around the molten pool, and the solder paste connects the soldered part to the conductive pad. The conductive gasket is welded, and the material of the welding part and the material of the conductive gasket are fused together by laser, so the strength of the welding part welded to the conductive gasket is very stable. When the chip module is pressed down During the terminal, the welding part will not be separated from the conductive pad, so as to ensure a good electrical connection between the electrical connector and the circuit board, and solder paste is provided around the molten pool, which increases the contact between the welding part and the conductive pad The area reduces the electrical impedance during signal transmission, thereby providing good signal transmission performance between the chip module and the circuit board.

Description

technical field [0001] The present invention relates to an electrical connector and an assembling method thereof, in particular to an electrical connector that is electrically connected to a chip module and an assembling method thereof. Background technique [0002] The Chinese Patent No. 03146989.2 discloses an electrical connector, including a circuit board, which is provided with a plurality of conductive pads, and the conductive pads are coated with solder paste; a plurality of terminals, each of which has a A soldering portion and a contact portion, the soldering portion is soldered to the conductive pad by heating the solder paste, and the contact portion is used to abut the chip module upward. [0003] However, when the chip module presses down the contact portion of the terminal, the soldering portion tends to move upward. Due to the weak soldering strength of the solder paste, it is easy to cause solder cracks, thereby affecting the electrical connection between the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K1/18H01R12/70
Inventor 黄常伟
Owner DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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