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Atomization heat radiation cooling system

A heat dissipation cooling and liquid cooling technology, applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problem of limited heat dissipation effect, and achieve the best heat dissipation effect.

Inactive Publication Date: 2011-10-05
MICROJET TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The main purpose of the present invention is to provide an atomized heat dissipation cooling system to solve the shortcomings of the existing liquid cooling system, such as only using the cooling liquid for repeated circulation, so that the heat dissipation effect is limited.

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Embodiment Construction

[0015] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the description in the following paragraphs. It should be understood that the present invention can have various changes in different aspects, all of which do not depart from the scope of the present invention, and the descriptions and diagrams therein are used for illustration in nature, not for limiting the present invention. invention.

[0016] The atomization heat dissipation cooling system of the present invention can be applied to the inside of the main body casing of an electronic device (for example: a notebook computer), and mainly dissipates heat to the heat-generating electronic components of the main body casing. Please refer to figure 1 , which is a schematic structural diagram of a cooling system in a preferred embodiment of the present invention. As shown in the figure, the cooling system 1 of this embodiment may include a liquid storage ...

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Abstract

The invention discloses an atomization heat radiation cooling system which is used for cooling a heat element. The system comprises: a liquid cooling apparatus; a liquid storage unit which is used for storing a fluid; an atomization heat radiation assembly, which is used for spraying the atomized fluid so as to absorb heat energy of the heat element; a conveying device, consisting of a first pumpand a second pump; a transmission pipe, which is used for connecting the liquid storage unit, the atomization heat radiation assembly, the first pump, the second pump and the liquid cooling apparatusin series so as to form a fluid circuit.

Description

technical field [0001] The invention relates to an atomization heat dissipation cooling system suitable for an atomization heat dissipation assembly. Background technique [0002] With the rapid development of the computer industry, the heat dissipation problem derived from the pursuit of high speed, high function and miniaturization of CPU is becoming more and more serious, which is more prominent in electronic devices with small internal space such as notebook computers. If the heat generated by the electronic components such as the CPU in the notebook computer cannot be dissipated effectively in real time, it will affect the performance of the electronic components and reduce the service life of the electronic components. Therefore, the industry usually uses a cooling device to cool the electronic components. Components dissipate heat. [0003] Among many cooling technologies, liquid cooling is an extremely effective cooling method. The traditional liquid cooling system...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
Inventor 莫皓然薛达伟张英伦余荣侯陈世昌
Owner MICROJET TECH