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Method for manufacturing pre-deformation line diamond line saw through powder metallurgy

A diamond wire saw and powder metallurgy technology, applied in the field of diamond wire saw preparation, can solve the problems of difficult control of surface roughness and surface shape accuracy, sudden breakage of electroplated diamond wire saw, shortened service life of wire saw, etc. High, low cost, stable cutting performance

Inactive Publication Date: 2012-10-10
长沙和谦新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Free abrasive wire saw cutting technology, that is, the cutting method of supplying abrasive slurry to the steel wire while cutting. The disadvantages of this process: it is easy to cause deep damage on the surface of the silicon wafer, and it is difficult to control the surface roughness and surface shape accuracy. Low efficiency, large abrasive consumption, harsh working environment, etc.
However, the disadvantages of the electroplated diamond wire saw cutting technology are: (1) a straight and single metal wire is used as the substrate, and the metal wire has two or more defects and residual tensile stress, which leads to , the sudden fracture of the electroplated diamond wire saw; (2) With the increase of processing times, chips adhere to the diamond surface, and the cutting performance gradually decreases due to the wear and shedding of the diamond abrasive grain itself; (3) High cost and low production efficiency Low
However, there are still two kinds of stress in the twisted wire, the residual tensile stress in the wire production process and the stress generated in the twisting process, these two kinds of stress lead to a shortened service life of the wire saw

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Two 0.15mm teardrop-shaped metal wires are twisted into a wire through a twister, and the twisting pitch is 0.5 mm. The shape of the twisted wire is changed into a corrugated shape with a period of 10mm in the length direction by a deformer to obtain a baseline ; Prepared powder: 3μm cobalt powder, 30μm diamond, binder content are 60%, 20%, 20% respectively, the binder is composed of 60% polypropylene, 30% paraffin and 10% agar; V-shaped mixture is used Machine mixing, the process parameters are: ball-to-material ratio 2:1, mixing time 30min, speed 450r / min; the powder is coated on the baseline by extrusion molding, the extrusion molding process parameters are: temperature 50°C, The pre-compression pressure is 10MPa, the extrusion pressure is 30MPa, the extrusion speed is 1.5m / min, and the radial thickness of the powder layer is 45μm; vacuum sintering is adopted, and the process parameters are: vacuum degree 10 -3 Pa, rise to 300°C at a heating rate of 5°C / min, hold fo...

Embodiment 2

[0029] Two 0.1mm circular molybdenum wires are twisted into a wire through a twister, the twisting pitch is 0.2mm, and the shape of the twisted wire is changed into an S shape with a period of 3mm in the length direction by a deformer, as the baseline; Formulated powder: 5 μm nickel powder and 5 μm cobalt powder (ratio: 2:1), 40 μm diamond, the content of which is 80% and 20% respectively; use a double-cone mixer to mix evenly, and the process parameters are: ball-to-material ratio 3 : 1, rotating speed 360r / min, time 1h; using dynamic magnetic pressing, its process parameters are: pressure 200MPa, speed 100m / min, radial thickness of powder material layer 60μm; using hydrogen sintering, process parameters are: H 2 The flow rate is 10L / min, and the temperature is raised to 850°C at a rate of 8°C / min, kept for 40 minutes, and cooled with the furnace. The 0.28mm pre-deformed wire diamond wire saw prepared with two round molybdenum wire twisted pre-deformed wires as the baseline h...

Embodiment 3

[0031] Two 0.15mm Z-shaped stainless steel wires are twisted into a wire, the twisting pitch is 6mm, and the shape of the twisted wire in the length direction is changed into a U shape with a period of 8mm by a deformer, which is used as the baseline; prepared powder: 8μm iron Powder and 5μm chromium powder (ratio 1:1), 20μm diamond, and binder content are 60%, 10%, and 30% respectively, of which the binder consists of 60% polymethyl methacrylate, 20% vegetable oil, 20% Composition of stearic acid; use ball mill to mix the powder evenly, the process parameters are: ball-to-material ratio 5:1, rotating speed 300r / min, ball milling time 2h; adopt powder slurry dip-coating forming process, process parameters are: powder layer The radial thickness is 50μm, the baseline moving speed is 10mm / min; the vacuum sintering process is adopted, and the process parameters are: vacuum degree 10 -3Pa, rise to 400°C at a heating rate of 7°C / min, hold for 30 minutes, then rise to 1000°C at a hea...

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Abstract

The invention provides a method for manufacturing a pre-deformation line diamond line saw through powder metallurgy, comprising the following steps: basic line manufacturing: selecting metal wires, stranding at least two metal wires into a line, and deforming the stranded line by a deformer to obtain a pre-deformation base line; powder preparation: weighing metal powder, a binder and diamond by mass percent, and adding the mixture into a blender mixer to evenly mixing; line blank manufacturing: putting the base line and powder into a mould, and taking the pre-deformation base line as a centerto prepare a line blank by using a forming technology; and line saw manufacturing: putting the line blank to a sintering furnace for sintering, and cooling with the furnace to obtain the line saw. The manufacturing method provided by the invention has the advantages of simple process, low cost and high production efficiency. The produced line saw has excellent performance, high strength, good flexibility, high hold to diamonds, stable cutting performance, good chip discharging performance and long service life, and is not easy to crack.

Description

Technical field [0001] The preparation method of the invention involves the diamond stone saw, which is specifically to prepare a method of pre -deformation line diamond saw for a powder metallurgy. Background technique [0002] The wire saw cutting technology is mainly used in the cutting of hard and crisp materials such as silicon wafers, gems, ceramics, and crystals, and has good development prospects.Swiming abrasive line saw cutting technology, that is, the cutting method with abrasive slurry is supplied to the steel wire while cutting.Low -efficiency, large abrasive consumption, bad operating environment, etc. [0003] In order to solve the above problems, the technique of seeing the scales of solid abrasive lines has gradually developed. The preparation method includes resin -binding agent curing technology and electroplating technology.The resin -binding diamond saw has the advantages of low cost and fast preparation speed, but its abrasion resistance and heat resistance ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F7/08B23D61/18B28D1/12
Inventor 不公告发明人
Owner 长沙和谦新材料科技有限公司
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