Ceramic electronic component
A technology of electronic components and ceramic components, which is applied in the field of ceramic electronic components, can solve the problems of cracks in ceramic components and short surface distance of insulating exterior materials, and achieve the effects of reducing usage, high production efficiency, and preventing surface discharge
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no. 1 approach
[0033] figure 1 (A) is a plan view of the surface mount type ceramic capacitor of the first embodiment, figure 1 (B) is figure 1 (A) I-I section view. Ceramic Capacitors with: BaTiO 3 Disc-shaped ceramic element 1 constituted by the like; metal terminals 2, 3 bonded to the front and back of ceramic element 1;
[0034] The ceramic element 1 has a ceramic substrate having a surface 11a facing each other, a back surface 11b, and an outer peripheral surface 11c. Such as figure 2 As shown in (A), electrodes 5 and 6 are formed on the entire surface 11 a and rear surface 11 b of the ceramic substrate 1 a. The electrodes 5 and 6 are composed of Ni, Cu, Ag, Cr, or an alloy mainly composed of any of them, and are formed by electroless plating, vapor deposition, or printing. Moreover, electrodes 5, 6 such as figure 2 As shown in (B), it may not be formed on the entire surfaces of the front surface 11a and the back surface 11b, but may be formed retreating from the outer peripher...
no. 2 approach
[0041] image 3 (A) is a top view of a surface mount type ceramic capacitor according to the second embodiment, image 3 (B) is image 3 (A) III-III sectional view. The ceramic capacitor includes: a disk-shaped ceramic element 1 ; metal terminals 2 and 3 bonded to the front and back of the ceramic element 1 ; and an insulating exterior material 4 covering the ceramic element 1 and part of the metal terminals 2 and 3 . In addition, the ceramic element 1 is the same as that described in the first embodiment, and its detailed description will be omitted.
[0042] The metal terminal 2 has a bonding portion 20 extending parallel to the surface 11 a and bonding to the electrode 5 , a mounting portion 24 extending parallel to the bonding portion 20 and mounted on the mounting substrate P, and a connection portion connecting the bonding portion 20 and the mounting portion 24 . Relay unit 22. Likewise, the metal terminal 3 has a bonding portion 30 extending parallel to the back sur...
no. 3 approach
[0052] Figure 4 (A) is a plan view of a surface mount type ceramic capacitor according to a third embodiment, Figure 4 (B) is Figure 4 (A) Section IV-IV. The ceramic capacitor according to the third embodiment is a modification of the ceramic capacitor according to the second embodiment, and includes: a disk-shaped ceramic element 1; metal terminals 2 and 3 joined to the front and back of the ceramic element 1; and covering the ceramic element 1. And the insulating exterior material 4 which is a part of the metal terminals 2 and 3 . In addition, in Figure 4 In (A) and CB), the same members or the same parts as those in the second embodiment are denoted by the same symbols, and detailed description thereof will be omitted.
[0053] The widths W1, W2 of the joints 20, 30 of the metal terminals 2, 3 are designed to be larger than the diameter D of the ceramic element 1, and the edge of the ceramic element 1 recedes from the edge of the joints 20, 30 in plan view. At this...
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Abstract
Description
Claims
Application Information
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