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Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body

A technology for fixing devices and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., and can solve problems such as bridging between bumps, warpage of laminated substrates, and defects in cold solder joints

Active Publication Date: 2013-07-17
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the step of picking and placing the chip on the build-up substrate, it is easy to cause the build-up substrate to warp, resulting in bridging between bumps or cold solder joint defects

Method used

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  • Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body
  • Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body
  • Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body

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Embodiment Construction

[0050] Hereinafter, each embodiment is described in detail and examples accompanied by accompanying drawings are used as a reference basis of the present invention. In the drawings or descriptions in the specification, the same reference numerals are used for similar or identical parts. And in the drawings, the shapes or thicknesses of the embodiments may be enlarged, and marked for simplicity or convenience. Furthermore, the parts of each element in the drawings will be described separately. It should be noted that the elements not shown or described in the drawings are forms known to those of ordinary skill in the art. In addition, specific embodiments only The specific mode used in order to illustrate the present invention is not intended to limit the present invention.

[0051] Figure 1A A schematic perspective view showing a substrate fixing device for packaging according to an embodiment of the present invention, Figure 1B show Figure 1A The cross-sectional schemati...

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PUM

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Abstract

The invention discloses a packaging substrate fixing device and a method for manufacturing a semiconductor chip packaging body. The packaging substrate fixing device comprises a bottom plate, a lamination substrate and an upper fixing cover plate, wherein the lamination substrate is provided with multiple chip crystal placing areas for allowing at least one chip to be jointed; and the lamination substrate is flatly fixed between the bottom plate and the upper cover fixing plate through a magnetic force or a mechanical force, wherein the upper cover fixing plate is provided with multiple opening areas corresponding to the multiple chip crystal placing areas.

Description

technical field [0001] The invention relates to a substrate fixing device for packaging and a method for manufacturing a semiconductor chip package, in particular to a substrate fixing device for chip-type flip-chip packaging and a method for manufacturing the chip-type flip-chip package. Background technique [0002] The traditional flip chip packaging technology (Flip Chip CSP, fcCSP for short), flips the chip, and then connects it to the laminated substrate through a metal conductor in a face-down manner. It is widely used in applications that require high performance and high speed. with high density, and small packaged components. [0003] As the size of the semiconductor device shrinks, the pitch of the electrical connection bumps also gradually shrinks. If the traditional chip-type flip-chip packaging technology is used, when the chip is attached upside down to the build-up substrate, the build-up substrate will be warped due to external force, making it easy to brid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/12H01L21/58
Inventor 王宗鼎郑荣伟李柏毅余振华李建勋
Owner TAIWAN SEMICON MFG CO LTD