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Structure of electronic product enclosure panel and manufacturing process thereof

A technology for electronic products and casings, which is applied in the field of casing structure and its processing technology. It can solve the problems that the radiation protection of the casing cannot be achieved, the strength of the casing panel is reduced, and the radiation protection performance is poor, so as to achieve simple processing and convenient structure. Processing, high strength effect

Inactive Publication Date: 2015-07-15
KUSN TONG YIN INDAL ELECTRONICS MAKING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The casing panels of traditional electronic products are made of plastic materials, and the surface of the product will be uneven. Therefore, it is necessary to perform multiple grinding procedures before painting to meet the requirements of the casing panels. The processing is more complicated, and the radiation protection performance is not good. good
There are still some casing panels made of metal materials on the market. This kind of metal casing panels are not easy to break, but the metal casing panels need to be fixed on the metal, which reduces the strength of the casing panels. Moreover, the thickness and weight of the casing panel are increased
Moreover, the casings of some existing products such as computers or mobile phones cannot achieve an ideal effect in terms of radiation protection.

Method used

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  • Structure of electronic product enclosure panel and manufacturing process thereof

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Embodiment

[0020] Embodiment: A structure of an electronic product 4 casing panel and a manufacturing method thereof:

[0021] A. Carry out hardening treatment (such as anodizing) to the outer surface of the metal panel 1 first. The metal panel is an aluminum plate, a magnesium plate, an alloy plate or a stainless steel plate, etc., and the thickness of the metal panel is 0.15-10 mm.

[0022] B. After the outer surface of the metal panel is hardened, the metal panel is punched to form the metal panel into the desired shape and size.

[0023] C. Roughen the inner surface of the metal panel to form a roughened surface.

[0024] D. After roughening, clean the metal panel to remove dust particles and residual oil after roughening.

[0025] E. The metal panel and the hot melt adhesive film 3 are heated to a set temperature and maintained at the set temperature for a set time under a set pressure condition, and then cooled to finally complete the roughened surface of the metal panel and The ...

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Abstract

The invention discloses a structure of an electronic product enclosure panel and a manufacturing process thereof. In the invention, metal with characteristics of good radiation protection effect, high strength, high-temperature resistance and the like, and plastic cements with characteristics of light weight, convenience of structure machining and the like are fully combined to realize injection molding on the metal surface through an intermediate medium hot melt adhesive membrane, so that a purpose of fixing and combination of a metal panel and a plastic element is reached, and an electronic product enclosure panel using the metal panel as the enclosure external surface and using the plastic element as the structural element is manufactured, therefore, the electronic product enclosure panel has the advantages of good radiation protection effect, high strength, corrosion resistance, high-temperature resistance, attractiveness, light weight, convenience for machining and the like and can manufacture complex structural elements and the like.

Description

technical field [0001] The invention relates to a casing structure of an electronic product and its processing technology, in particular to a casing made of metal and plastic and its processing technology. Background technique [0002] The casing panels of traditional electronic products are made of plastic materials, and the surface of the product will be uneven. Therefore, it is necessary to perform multiple grinding procedures before painting to meet the requirements of the casing panels. The processing is more complicated, and the radiation protection performance is not good. good. There are still some casing panels made of metal materials on the market. This kind of metal casing panels are not easy to break, but the metal casing panels need to be fixed on the metal, which reduces the strength of the casing panels. Moreover, the thickness and weight of the casing panel are increased. Moreover, the casings of some existing products such as computers or mobile phones can...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/02H05K5/04B29C45/00
Inventor 廖伟宇
Owner KUSN TONG YIN INDAL ELECTRONICS MAKING
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