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Device and method for coating a substrate using CVD

A device and coating technology, which is applied in chemical instruments and methods, semiconductor/solid-state device manufacturing, coating, etc., can solve the problems of thermal conductor rupture and unusability, and achieve the effect of increasing service life

Active Publication Date: 2014-06-25
DIACCON +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The devices known from the prior art have the disadvantage that the thermal conductors are already broken after one or two coating steps and can then no longer be used
[0003] Although it is conceivable to use a relatively thick heat conductor having a diameter of about 2 mm to eliminate the above-mentioned disadvantages, the use of this relatively thick heat conductor also has disadvantages

Method used

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  • Device and method for coating a substrate using CVD
  • Device and method for coating a substrate using CVD
  • Device and method for coating a substrate using CVD

Examples

Experimental program
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Embodiment Construction

[0042] figure 1A schematic of the first device is shown. A plurality of heat conductors 2 are mounted consecutively in a row on the first electrode 1, preferably at about the same distance from each other. The heat conductor 2 can be held by being clamped in a holder unit 3 provided on the first electrode 1 . The heat conductors 2 are individually held taut by weights 4 arranged at their ends. The cylindrically designed weight 4 is guided in a sliding manner into a corresponding recess 5 provided on the second electrode 6 . Here, the second electrode 6 is located below the first electrode 1 at a vertical face extending past the first electrode 1 . The groove 5 has a straight contact line or surface in the axial direction with respect to the weight 4 . The support unit 3 on the first electrode 1 and the recess 5 on the second electrode 6 are designed in such a way that the heat conductors 2 are held taut in an essentially parallel arrangement.

[0043] figure 2 show base...

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Abstract

The invention relates to a device for coating a substrate using CVD, in particular for coating with diamond or silicon, wherein a neat conductor array composed of a plurality of elongated heat conductors (2) is provided in a housing (9), said heat conductors extending between a first (1) and a second electrode (6), wherein the heat conductors are held individually tensioned by a weight (4) attached to one end thereof. To increase the life of the neat conductors (2), the invention proposes that the weight (4) or the heat conductor (2) be guided at the second electrode (6), forming an electrical loop contact, in such a way that a vector of the weight force (G) produced by the weight (4) makes an angle (α) of no more than 45° with a direction of the longitudinal extension of the heat conductor (2).

Description

technical field [0001] The invention relates to a device as defined in the preamble of claim 1 and to a method of using the device. Background technique [0002] This device is known from JP 01072992A. The heat conductor thus lies horizontally above the substrate to be coated. In order to generate the proper tension, the heat conductor is guided over a redirection unit and provided with a weight at one end thereof. The devices known from the prior art have the disadvantage that the heat conductors are already broken after one or two coating steps and can then no longer be used. In actual practice, it is necessary to replace the heat conductor after each coating step. This requires a lot of time and expense. [0003] Although it is conceivable to use a relatively thick heat conductor having a diameter of about 2 mm to eliminate the above-mentioned disadvantages, the use of this relatively thick heat conductor also has disadvantages. Compared to thin heat conductors, thic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/27H01L21/00
CPCC23C16/44C23C16/24C23C16/271H01L21/67115C23C16/27C30B29/04C30B29/06
Inventor M.鲁弗S.罗西瓦尔C.巴雷斯W.雷克特O.莱莫M.珀尔
Owner DIACCON