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Light-emitting diode with independent electrical and heat transfer paths and manufacturing method thereof

A technology of light-emitting diodes and manufacturing methods, which is applied in the direction of circuits, electrical components, and electrical solid-state devices, and can solve problems affecting device reliability and the like

Inactive Publication Date: 2011-12-28
SEMILEDS OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, problems may arise if thermally conductive elements are also used in the electrical conduction path, or elements close to the electrical conduction path
In such conditions, thermal gain can be cumulative, further negatively affecting device reliability

Method used

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  • Light-emitting diode with independent electrical and heat transfer paths and manufacturing method thereof
  • Light-emitting diode with independent electrical and heat transfer paths and manufacturing method thereof
  • Light-emitting diode with independent electrical and heat transfer paths and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] refer to Figure 1A and 1B , the side-by-side LED 10A includes a heat-conducting substrate 12A, and an LED chip 14A fixed on the heat-conducting substrate 12A. The thermally conductive substrate 12A includes a front side 20A, a back side 22A, a silicon substrate 24A, and an electrically insulating isolation layer 38A. As will be further described below, the thermally conductive substrate 12A provides vertical electrical isolation and thermally conductive heat transfer paths.

[0051] Light emitting diode 10A also includes anode 16A in the form of anode make connection 30A in electrical communication with LED die 14A, and cathode 18A in the form of cathode make connection 32A in electrical communication with LED die 14A. The anode 16A and the cathode 18A are arranged in parallel on the thermally conductive substrate 12A, so the light emitting diode 10A is called a parallel light emitting diode. Furthermore, the anode make connection 30A includes a backside contact 60A,...

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PUM

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Abstract

A light emitting diode includes a thermal conductive substrate having at least one electrical isolation layer configured to provide vertical electrical isolation and a heat transfer path through the substrate from a front side (first side) to a back side (second side) thereof. The light emitting diode includes an anode having a through interconnect, and a cathode having a through interconnect, which are arranged side by side on the substrate. The light emitting diode also includes a LED chip mounted to the substrate between the anode and the cathode. A method for fabricating the light emitting diode includes the steps of providing a thermal conductive substrate having an electrical isolation layer, forming an anode via and a cathode via side by side on a first side of the substrate part way through the substrate, forming an anode through interconnect in the anode via and a cathode through interconnect in the cathode via, thinning the substrate from a second side of the substrate to the anode through interconnect and the cathode through interconnect, and mounting a LED chip to the first side in electrical communication with the cathode through interconnect and the anode through interconnect.

Description

technical field [0001] Basically the present invention relates to optoelectronic components, and more particularly to a side by side light emitting diode with independent electrical and thermal conduction paths, and to a method of manufacturing such a light emitting diode (LED). Background technique [0002] An optoelectronic system, such as a light emitting diode (LED) display, may contain an array of from hundreds to thousands of light emitting diodes (LEDs). Light emitting diodes (LEDs) can generate a large amount of heat, which must be dissipated. In addition, LED circuits coupled with light emitting diodes (LEDs) can also generate heat. Heat can negatively affect both light emitting diodes (LEDs) and LED circuitry. For example, heat can shorten the life cycle of light emitting diodes (LEDs) and LED circuits. Heat can also cause accidental burning of light emitting diodes (LEDs), and signal transmission errors in LED circuits. [0003] The heat dissipation function i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/62H01L33/14H01L33/00
CPCH01L2933/0066H01L33/641H01L33/62H01L2224/73265
Inventor 段忠朱振甫刘文煌樊峰旭郑好钧王服贤
Owner SEMILEDS OPTOELECTRONICS CO LTD