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Manufacturing method of optical waveguide, optical waveguide and photoelectric composite circuit board

A manufacturing method and optical waveguide technology, which is applied in the field of flexible optical waveguides, can solve the problems of difficult control of film thickness, easy control of the film thickness of the upper cladding layer, and difficulty in tilting the core, etc.

Inactive Publication Date: 2011-12-28
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the method using the above-mentioned solution, it is not easy to control the film thickness, especially after the step of removing part of the applied solution, it is not easy to control the inclination of the core for leveling.
[0008] In addition, although the technology disclosed in Patent Document 1 makes the upper cladding layer of the bent portion thinner without changing the core size and improves the bending resistance durability of the optical waveguide, it is not necessarily easy to control a part of the upper cladding layer. Therefore, it is desired to find a method to easily improve the bending durability

Method used

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  • Manufacturing method of optical waveguide, optical waveguide and photoelectric composite circuit board
  • Manufacturing method of optical waveguide, optical waveguide and photoelectric composite circuit board
  • Manufacturing method of optical waveguide, optical waveguide and photoelectric composite circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0191] (1) Preparation of resin film for coating layer formation

[0192] 48 parts by mass of phenoxy resin (trade name: PHENOTOTE YP-70, manufactured by Toto Chemical Co., Ltd.) as (A) binder polymer, and 48 parts by mass as (B) photopolymerizable 49.6 parts by mass of an alicyclic diepoxycarboxylate (trade name: KRM-2110, molecular weight: 252, manufactured by ADEKA Co., Ltd.) of a compound or a thermally polymerizable compound, as (C) a photopolymerization initiator or a thermal polymerization initiator 2 parts by mass of triphenylsulfonium hexafluoroantimonate (trade name: SP-170, manufactured by ADEKA) as a sensitizer, 0.4 parts by mass of SP-100 (trade name, manufactured by ADEKA) as a sensitizer , 40 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent, using a mechanical stirrer, a rotating shaft and a propeller, stirred for 6 hours at a temperature of 25°C and a rotation speed of 400rpm, and blended the coating layer. Resin varnish A. The...

Embodiment 2

[0217] A flexible optical waveguide and a photoelectric composite circuit board were produced in the same manner as in Example 1, except that a flat-plate vacuum pressure laminator was not used for smoothing in Example 1. exist Figure 15 In , the film thickness measurement results of the produced flexible optical waveguide are shown. In the repeated sliding test of the photoelectric composite wiring board, the optical waveguide did not break even after passing through 100,000 times, showing good bending durability (sliding durability). On the other hand, the insertion loss was 2.2 dB, and a loss increase of 1.2 dB was observed compared with the case of smoothing, and it was confirmed that smoothing is preferable for applications requiring high optical characteristics. (Refer to Table 1).

[0218] Table 1

[0219]

Embodiment 3

[0221] (1) Preparation of resin film for coating layer formation

[0222] Except that the cured film thickness of the resin layer of the resin film for cladding layer formation was adjusted so that both the lower cladding layer and the upper cladding layer were 20 μm, the same operation as the above-mentioned Example 1 was carried out to produce a clad layer forming film. resin film.

[0223] (2) Preparation of resin film for core layer formation

[0224] Except having adjusted the film thickness of the resin layer of the resin film for core layer formation to 50 micrometers after hardening, it carried out similarly to the said Example 1, and produced the resin film for core layer formation.

[0225] (3) Fabrication of flexible optical waveguide

[0226] Peel off the release PET film (Purex A31) which is the protective film of the resin film for forming the lower cladding layer obtained above, and use an ultraviolet exposure machine (manufactured by ORC Seisakusho, EXM-1172)...

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Abstract

(1) Disclosed is a method for producing a flexible optical waveguide, which comprises: a step of forming a first cladding layer; a step of forming a first core layer by arranging a core layer-forming resin film on at least one end portion of the first cladding layer; a step of forming a second core layer by arranging a core layer-forming resin film on the entire surface of the first core layer and the entire surface of the first cladding layer; a step of forming a core pattern by patterning the first and second core layers; and a step of embedding the core pattern by forming a second cladding layer on the core pattern and the first cladding layer. (2) Disclosed is a flexible optical waveguide comprising a lower cladding layer, a core part and an upper cladding layer, wherein the width of the upper cladding layer is smaller than the width of the lower cladding layer at least in the bending portion, while being equal to or smaller than the width of the lower cladding layer in the end portions, and the width of the lower cladding layer in the bending portion is equal to or smaller than the width thereof in the end portions. Also disclosed is a method for producing the flexible optical waveguide. The flexible optical waveguide has excellent bending durability and little light loss.

Description

technical field [0001] The present invention relates to a flexible optical waveguide excellent in bending durability and optical transmission characteristics, a manufacturing method thereof, and an optoelectronic composite wiring board using the flexible optical waveguide. Background technique [0002] In recent years, in the high-speed and high-density signal transmission between electronic components and between circuit boards, the mutual interference and attenuation of signals have become obstacles in the conventional transmission through electric wiring, and high-speed and high-density signal transmission has begun to be seen. the restriction of transformation. In order to overcome this limitation, a technique of optically connecting electronic components and circuit boards, that is, a so-called optical interconnection, has been studied. As an optical transmission path, polymer optical waveguides have attracted attention from the viewpoints of ease of processing, low co...

Claims

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Application Information

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IPC IPC(8): G02B6/12G02B6/13
CPCG02B6/138G02B6/1221Y10T156/1039G02B6/1228G02B6/132G02B6/43
Inventor 柴田智章黑田敏裕山口正利八木成行增田宏
Owner HITACHI CHEM CO LTD
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