Device for improving movement accuracy of mechanical arm and use method thereof

Abstract

The invention provides a device for improving the movement accuracy of a mechanical arm and a method. The device comprises a control device, the mechanical arm, an aligning cavity, a reaction cavity and a feedback device, wherein the control device controls the mechanical arm to move according to the preset position, a wafer is placed on the mechanical arm and is conveyed into the aligning cavity to be aligned, then, the wafer is conveyed into the reaction cavity for reaction, and the feedback device is connected with the control device and is used for detecting the actual position of the wafer conveyed by the mechanical arm and generating feedback signals to be fed back to the control device. The feedback device is added in the device, the movement accuracy of the mechanical arm can be effectively improved, and in addition, the wafer quality problem caused by mechanical arm movement errors can be effectively prevented.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a device for improving the movement accuracy of a mechanical arm and a method for using the same. Background technique [0002] In the field of semiconductors, reaction chambers are commonly used equipment and can be used in chemical vapor deposition, physical vapor deposition, and etching processes. The wafer is deposited and grown in the reaction chamber. For the wafer, the uniformity is the main factor of the quality of the wafer and an important factor of the product quality. The uniformity of the temperature has a great influence on the uniformity of the film on the wafer surface. important influence. [0003] Currently, during the process, a robot arm is usually used to transport the wafer into the reaction chamber. However, due to problems such as belts and motors, the mechanical arm will deviate during the process of driving the wafer. This deviation will not ...

AI Technical Summary

Problems solved by technology

However, due to problems such as belts and motors, the mechanical arm will deviate during the process of driving the wafer. This deviation will not accurately transport the wafer to the optimal position in the reaction chamber, resulting in uneven heating of the wafer. Affect the quality of the wafer, and even the problem of abnormal wafer color

Due to the low sensitivity of the mechanical arm, it will not alarm even if a large displacement occurs; and even if a problem is found, it is difficult to adjust the major position of the wafer in the alignment chamber during the working process of the process equipment;

If adjustments are made by stopping work, such as replacing the motor, replacing the belt, cleaning the machine, etc., it will greatly reduce the work efficiency and affect the yield and quality of the wafer

Images