Conveying system for integrated circuit chip loader framework

An integrated circuit and conveying system technology, applied in the field of fully automatic conveying system, can solve problems such as low production efficiency, pollution, and lack of precise control parts in the conveying mechanism, and achieve the effect of high degree of automation and precise control

Active Publication Date: 2013-04-24
南通金泰科技有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

In the specification of patent 200710019239.3, the method of applying glue on the lead frame of integrated circuits disclosed in the specification has no precise control parts in the conveying mechanism, so the method of partially covering the film is adopted, which leads to low production efficiency and pollution.
A quartz wafer loader disclosed in patent 200720094963.8 has no free adjustment function and precise control function for the size of the conveying track, and is not suitable for the use and precise control of series products

Method used

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  • Conveying system for integrated circuit chip loader framework
  • Conveying system for integrated circuit chip loader framework

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Experimental program
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Embodiment Construction

[0014] Select the feeding manipulator 3 and the feeding sensor 4 with suitable specifications and functions to make the feeding mechanism 5; select several sets of clamping jaw groups 9, two rails 7, driving elements 1, and track sensors 2 with suitable specifications and functions to make It is the rail mechanism 8; the blanking manipulator 12 and the blanking sensor 14 with appropriate specifications and functions are selected to be made as the blanking mechanism 13;

[0015] Arrange each component according to figure 1 Install as shown. The lead frame 11 is now transported into the blanking unit 10, the width 16 between the jaw groups and the thickness 17 between the jaw groups match the dimensions of the lead frame 11, and the width 16 between the jaw groups passes between the jaw groups. The distance between the jaw groups is adjusted, and the thickness 17 between the jaw groups is adjusted through the thickness adjustment slits 18 of the jaw groups.

[0016] After the ...

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Abstract

The invention provides a conveying system for an integrated circuit chip loader framework. The conveying system comprises a feeding mechanism, a track mechanism, a discharging mechanism and program controlled equipment, wherein the feeding mechanism comprises a feeding mechanical hand and a feeding sensor, an open type platform is adopted for the track mechanism, the width and the thickness of a lead framework groove in the track mechanism can be regulated, the discharging mechanism comprises a discharging mechanical hand and a discharging sensor, and the conveying system is driven by a ball screw driven a motor. The conveying system is suitable for conveying lead frameworks of various specifications, is accurate in feeding amount control and high in automation degree, and can be used in an integrated circuit chip loader in scale production.

Description

technical field [0001] The invention relates to a conveying system of an integrated circuit chip loader, in particular to a fully automatic conveying system of an integrated circuit lead frame which can be precisely controlled. Background technique [0002] Picking up and loading the chips of the integrated circuit onto the lead frame of the integrated circuit is a key operation step of the integrated circuit chip loader. Usually, the conveying system of the IC chip loader includes a feeding mechanism, a rail mechanism, and a feeding mechanism. In the traditional integrated circuit chip loader, it is difficult to achieve fully automatic operation for the picking, transmission and placement of the lead frame, with low production efficiency and low chip loading accuracy, and it is difficult to adapt to the use of lead frames of different sizes. A feeding mechanism for integrated circuits disclosed in the specification of Patent 200720131627.9, although a manipulator is used, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50
Inventor 刘建峰徐银森李承峰胡汉球苏建国吴华
Owner 南通金泰科技有限公司
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