Heat radiation device

Abstract

The invention relates to a heat radiation device, which is used for the heat radiation on a heating electronic element and comprises a first heat radiator and a second heat radiator arranged on the first heat radiator, wherein the first heat radiator is used for being pasted on the heating electronic element, the size of the second heat radiator is smaller than that of the first heat radiator, and the second heat radiator is detachably and thermally connected onto one side on the first heat radiator. When the heat radiation device is used for the heat radiation on the heating electronic element, the heat generated by the heating electronic element is partially radiated through the first heat radiator and is partially transmitted to the second heat radiator through the first heat radiator to be radiated through the second heat radiator, and the size and the position setting of the second heat radiator are relatively flexible, so the second heat radiator can share a part of heat radiation function for ensuring that the heat radiation device has higher heat radiation efficiency, and in addition, the interference on other electronic elements around the heating electronic element caused by the heat radiation device can also be reduced.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for heat dissipation of electronic components. Background technique [0002] With the rapid development of the electronic information industry, the heat-generating electronic components in electronic devices such as computers and servers, such as the central processing unit (CUP), memory sticks, etc., generate more and more heat. If the heat is not dissipated in time, the And greatly affect the operation stability and service life of electronic devices. In order to dissipate the heat from the heat-generating electronic components in the electronic device, the industry usually uses a metal heat sink with functions of heat collection, heat transfer and heat dissipation to assist the heat-generating electronic components to dissipate heat. [0003] Generally, the larger the radiator, the higher the heat dissipation efficiency of the radiator. However, when a ra...

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Problems solved by technology

[0003] Generally, the larger the radiator, the higher the heat dissipation efficiency of the radiator. However, when a radiator with a larger volume is used to dissipate heat from a heat-generating electronic component, the radiator will usually interact with other electronic components around the heat-generating electronic component. Interference occurs, which makes the installation of the radiator extremely inconvenient, and even damages other electronic components. This situation is more prominent in relatively small electronic devices, such as 1U (1U=4.445cm) servers, but when using volume When a small radiator is used for heat dissipation, the heat dissipation efficiency of the radiator is difficult to meet the heat dissipation requirements

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