Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for preventing printing ink from entering hole during preparation process of printed circuit board (PCB)

A preparation process and PCB board technology, which is applied in the field of PCB board manufacturing, can solve the problems of many solder mask ink holes, heavy work/high scrapping, etc., and achieve the effects of simplified production process operation, improved production efficiency, and reduced production time

Inactive Publication Date: 2014-04-09
奥士康精密电路(惠州)有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] The production of the existing PCB is mainly processed in sequence according to the operation process of "grinding-screen printing-pre-baking-alignment-developing-post-baking". It often leads to the problem of heavy work / high scrapping. The operation process is studied in order to solve this problem well. Finally, through the research, it is found that on the basis of not changing the existing PCB production process, only the silk screen operation needs to be improved as follows, then Can effectively solve the problems existing in the existing technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The PCB solder mask production of this embodiment is the same as that of the comparative embodiment except that the silk screen operation is improved as follows.

[0040] The improvement of silkscreen operation is:

[0041] 1. Require maintenance and suppliers to improve the existing screen printing machine. Install a suction device on the screen printing machine. The suction device includes suction holes distributed on the screen printing table and suction fans connected to the suction holes through pipes. Including the adjustment parts for adjusting the wind force of the suction hole; the suction holes distributed on the screen printing table are required to have a diameter of 1.0mm to 1.5mm and a hole spacing of 10×10mm;

[0042] 2. After the first side is printed, the suction device is automatically turned on. The power of the suction fan is required to be 0.75-1.00KW, and the suction time is within 20 seconds (adjustable). The ink in the hole is sucked out, and the...

Embodiment 2

[0046] Comparative example and embodiment 1 are compared and found:

[0047] The production of embodiment 1 reduces the production time by more than 20% (mainly for reducing the time of heavy work), the rework rate of embodiment 1 is also very low, basically controlled within 1%, the appearance inspection meets the requirements of the IPC-600G standard, and the printing effect can be achieved. fulfill customer's request.

[0048]In Example 1, the bed of nails suspends the printing plate and makes its periphery form a sealed form. At the same time, the ink in the printing hole is sucked out of the hole by the suction function on the screen printing machine, so as to realize no ink entering the hole and provide a basis for subsequent development. .

[0049] In the comparative example, the phenomenon of ink entering the hole is more serious, resulting in unclean development, not only the product quality is not good, but also the production efficiency is low, the rework rate is h...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for preventing printing ink from entering a hole during preparation process of a printed circuit board (PCB), which is characterized in the following improvement to the silk-screen printing operation in the prior art is that: a silk-screen printer with an air suction device and with wind power being adjustable is adopted; the air suction device is started after the printing of a first surface is completed, printing ink in the hole is sucked out, then the second surface is printed, and the air suction is unnecessary for the second surface; a nail bed is necessarily adopted for the printing of the first surface and the printing of the second surface during the silk-screen printing operation process; and a baffle screen is adopted for the printing of the first surface and the printing of the second surface. Due to the adoption of the method, only the printing mode, the printing method and the production parameters are required to improve on the basis of the present silk-screen printing, each quality performance can satisfy the requirements of the customer, the production efficiency can be remarkably improved, the production and the operation can be simplified, the cost can be reduced, and the product appearance effect is good. The production time can be comprehensively reduced by more than 20 percent, the rework rate can be controlled within 1 percent, the appearance inspection conforms to IPC-60G standard, and the printing effect can satisfy the requirements of the customer.

Description

technical field [0001] The invention relates to the technical field of PCB board manufacturing, in particular to solder mask production in the PCB board manufacturing process, and in particular to a method for improving ink entry holes in the PCB board manufacturing process. Background technique [0002] With the extensive development of PCB production technology and application fields, various high-end and low-end electronic equipment products require a large number of PCBs. In order to meet the market's demand for production capacity and high precision, domestic large-scale PCB factories have invested heavily in the introduction of a large number of screen printing technologies and methods. , the investment in equipment and personnel is relatively large, so we make a comprehensive innovation for our company's existing screen printing machine technology to improve efficiency, reduce the company's production materials, equipment, water and electricity and labor costs, and imp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B41F15/14
Inventor 文国堂贺波
Owner 奥士康精密电路(惠州)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com