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Plane magnetic integrated electro magnetic interference (EMI) filter

A magnetic integration and filter technology, applied in the direction of inductance with magnetic core, structural fixed capacitor combination, transformer/inductor coil/winding/connection, etc. problems, to achieve the effect of good consistency, high power density, and production standardization

Active Publication Date: 2012-02-22
唐山尚新融大电子产品有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, it has the characteristics of large volume, difficult to achieve flat shape, poor filter standardization, and low power density.

Method used

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  • Plane magnetic integrated electro magnetic interference (EMI) filter
  • Plane magnetic integrated electro magnetic interference (EMI) filter
  • Plane magnetic integrated electro magnetic interference (EMI) filter

Examples

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Embodiment Construction

[0033] Please refer to the attached Figure 1 to Figure 11 As shown, the present invention is a planar magnetic integrated EMI filter, which is composed of a planar magnetic integrated common mode inductor 1, a PCB board 2 welded with a differential mode capacitor or a common mode capacitor 21, a non-magnetic metal shell 3, and a grounding lead The terminal 4, the inductor terminal 5 and the base plate 6 are composed of several parts. Among them, attached figure 1 The planar magnetic integrated EMI filter in uses differential mode capacitors 21, attached figure 2 The planar magnetic integrated EMI filter in uses common-mode capacitors 21.

[0034] The planar magnetic integrated common mode inductor 1 includes a pair of U-shaped magnetic cores 11 and a cylindrical or square bar-shaped magnetic core 12 located between the pair of U-shaped magnetic cores 11 . Wherein, the U-shaped magnetic core 11 is specifically made of U-shaped magnetic cores made of ferrite soft magnetic, ...

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Abstract

The invention relates to a plane magnetic integrated electro magnetic interference (EMI) filter. The plane magnetic integrated EMI filter comprises a plane magnetic integrated common mode inductor, a printed circuit board (PCB) which is welded with a differential mode capacitor or a common mode capacitor, a non-magnetic metal shell, a grounding leading-out terminal and an inductor leading-out terminal, wherein the plane magnetic integrated common mode inductor comprises a pair of U-shaped magnetic cores and cylindrical or cubic magnetic cores between the pair of U-shaped magnetic cores; the U-shaped magnetic cores are covered with single-layer or multi-layer windings; the cylindrical or cubic magnetic cores are accommodated in the non-magnetic metal shell and are insulated; the PCB is connected with the plane magnetic integrated common mode inductor; and one end of the inductor leading-out terminal is connected with the windings, and the other end of the inductor leading-out terminal is connected with the PCB. The plane magnetic integrated EMI filter has the advantages of flat shape, smaller volume, high power density, high filtering performance, standardized and modularized production and the like.

Description

【Technical field】 [0001] The invention relates to an EMI filter, in particular to a planar magnetic integrated EMI filter. 【Background technique】 [0002] With the development of electronic circuits towards high frequency, high power density, high reliability, and high integration, higher requirements are put forward for EMI filters. Complex EMI environment, integration, low loss, high power density, modularization, and flatness are the development trends of EMI filters. [0003] Most of the current EMI filters are composed of a single common-mode inductor, differential-mode inductor, common-mode capacitor, differential-mode capacitor, etc., or are composed of multiple stages. Generally, it has the characteristics of large volume, difficult to achieve flat shape, poor filter standardization, and low power density. The original traditional filter is incompatible with the current trend of high integration, high power density, planarization and modularization of electronic ci...

Claims

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Application Information

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IPC IPC(8): H01F17/04H01F27/30H01G4/40H03H7/09
Inventor 李建江王远才
Owner 唐山尚新融大电子产品有限公司
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