LED (light-lighting diode) chip packaging method and packaging structure
A technology of LED chip and packaging method, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems affecting the heat dissipation and electrical connection of the chip, chip failure, poor contact between the chip and the electrode, etc., and achieve the effect of improving reliability.
Active Publication Date: 2012-03-21
BYD SEMICON CO LTD
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- Abstract
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- Claims
- Application Information
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Problems solved by technology
[0005] The technical problem to be solved by the present invention is that the introduction of welding points in the prior art LED packaging structure causes poor contact between the chip and the electrode, affects the heat dissipation and electrical connection of the chip, and causes the problem of chip failure
Method used
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[0031] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0032] figure 2 It is a flow chart of a packaging method for an LED chip in an embodiment of the present invention; a packaging method for an LED chip, comprising: Step 1: providing a bracket with a reflective cup, the bottom of which is provided with an electrode channel; Step 2: placing the LED chip in the Into the reflective cup, keep the LED chip electrode aligned with the electrode channel; Step 3: Emboss the glue in the reflective cup, and fix the LED chip on the bottom of the reflective cup; Step 4: On the back of the reflective cup bottom and the electrode chann...
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Abstract
An LED (light-emitting diode) chip packaging method comprises the following steps: providing a bracket with a reflective cup, wherein an electrode channel is arranged at the bottom of the reflective cup; placing an LED chip into the reflective cup, and keeping the electrode of the LED chip to be aligned at the electrode channel; impressing glue in the reflective cup, and fixing the LED chip at the bottom of the reflective cup; and depositing conductive materials at the back surface of the bottom of the reflective cup and the electrode channel, thus forming an extraction electrode electrically connected with the LED chip. The invention also discloses a corresponding LED chip packaging structure. Compared with the prior art, the invention has the following benefits: the embodiment of the invention provides the LED chip packaging method and packaging structure, the LED chip is fixed in the reflective cup, and then the extraction electrode is manufactured on the back surface of the bottom of the reflective cup; and the packaging structure does not have any welding point, thus improving the reliability of an LED.
Description
technical field [0001] The invention belongs to the field of manufacturing and assembling of light-emitting diodes, and in particular relates to a packaging method and a packaging structure of an LED chip. Background technique [0002] At present, the commonly used packaging structures of LED (light-emitting diode) mainly include ordinary imitation lumen type and surface mount type. Ordinary imitation lumen structure such as Figure 1-1a and Figure 1-1b as shown, Figure 1-1a It is a schematic cross-sectional schematic diagram of a power LED imitation lumen package structure in the prior art; Figure 1-1b It is a top view schematic diagram of the power LED imitation lumen package structure in the prior art; in the middle of the bracket 5 is a reflective cup 10, and the chip 1 is mounted and fixed in the cup with a heat-conducting adhesive 4 first, and the bottom of the chip 1 is directly in contact with the heat-conducting metal 9, which can speed up the process. Heat dis...
Claims
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Login to View More IPC IPC(8): H01L33/48H01L33/62H01L25/075
CPCH01L2224/48091H01L2224/48247H01L2224/73265H01L2924/00014
Inventor 苏喜林刘英策火东明张旺
Owner BYD SEMICON CO LTD