Method for fixing proteins on surface of solid
A solid surface, protein technology, applied to the immobilization of proteins, using aluminum nitride film to fix proteins, can solve the problems of high cost, less obvious immobilization effect, cumbersome steps, etc., and achieve low cost, easy long-term storage, high activity Good results
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0024] This embodiment is implemented under the requirements of the following implementation conditions and technical conditions:
[0025] The solid substrate used in this embodiment is a silicon wafer covered with a 100 nm thick gold film.
[0026] The specific protein immobilization process is as follows:
[0027] (1) Put the silicon wafer into acetone, absolute ethanol, and deionized water in sequence, ultrasonically clean each for 3 minutes, take it out, and blow dry with nitrogen.
[0028] (2) A layer of aluminum nitride film with a thickness of 10 nanometers is deposited on the surface of the gold film by sputtering deposition technology.
[0029] (3) Add 0.2 mg / mL human IgG dropwise on the surface of the aluminum nitride film, and incubate at a constant temperature of 37° C. for 2 hours.
[0030] (4) Rinse three times with phosphate buffer solution with pH=7.0, and blow dry with nitrogen gas.
[0031] (5) Add 10 mg / mL bovine serum albumin blocking solution dropwise o...
Embodiment 2
[0037] This embodiment is implemented under the requirements of the following implementation conditions and technical conditions:
[0038] The solid substrate used in this example is a glass slide.
[0039] (1) Place glass slides in acetone, absolute ethanol, and deionized water in sequence, ultrasonically clean them for 3 minutes, take them out, and dry them with nitrogen.
[0040] (2) A layer of aluminum nitride film with a thickness of 50 nanometers is deposited on the surface of the gold film by sputtering deposition technology.
[0041] (3) Add 0.2 mg / mL human IgG dropwise on the surface of the aluminum nitride film, and incubate at a constant temperature of 37° C. for 2 hours.
[0042] (4) Rinse three times with phosphate buffer solution with pH=7.0, and blow dry with nitrogen gas.
[0043] (5) Add 10 mg / mL bovine serum albumin blocking solution dropwise on the aluminum nitride surface, and incubate at 37° C. for 1 hour.
[0044] (6) Rinse three times with phosphate b...
Embodiment 3
[0049] This embodiment is implemented under the requirements of the following implementation conditions and technical conditions:
[0050] The solid substrate used in this embodiment is a silicon wafer.
[0051] (1) Put the silicon wafer into acetone, absolute ethanol, and deionized water in sequence, ultrasonically clean each for 3 minutes, take it out, and blow dry with nitrogen.
[0052] (2) Patterning of AlN film:
[0053] Spin-coat photoresist 5 microns and perform photolithography to form a photoresist pattern opposite to the required aluminum nitride pattern.
[0054] A layer of aluminum nitride film with a thickness of 100 nm is deposited on the surface of the photoresist by sputtering deposition technology.
[0055] Soak the sample in acetone for 10 minutes to remove the photoresist and finally get the aluminum nitride pattern.
[0056] (3) Add 0.2 mg / mL human IgG dropwise on the surface of the aluminum nitride film, and incubate at a constant temperature of 37° C....
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More