Surface Processing Device

A surface treatment device and surface treatment technology, applied in the direction of cells, electrolytic processes, circuits, etc., can solve problems such as difficulty in removing bubbles, and achieve the effect of improving surface treatment capabilities

Inactive Publication Date: 2012-04-11
ALMEX PE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, there is a situation where it is more difficult to remove air bubbles that have entered the inside of the hole only by improving the wettability of the workpiece by making the diameter of the hole such as a through hole or a blind hole smaller.

Method used

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Embodiment Construction

[0043] Hereinafter, preferred embodiments of the present invention will be described in detail. In addition, the present embodiment described below does not unduly limit the content of the present invention described in the claims, and does not limit that all the configurations described in the present embodiment must be the solution of the present invention.

[0044] 1. Overview of surface treatment equipment

[0045] figure 1 is a plan view of a surface treatment device, for example, a continuous plating treatment device. The continuous electroplating processing apparatus 10 has a plurality of transport jigs 30 that respectively hold workpieces 20 such as circuit boards along the figure 1 For example, the circular conveying path 100 is circularly conveyed in the right-handed circular conveying direction A. In addition, in figure 1 The illustration of a part of the workpiece 20 and a part of the transport jig 30 is omitted.

[0046] In the circulation transport path 100...

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Abstract

The invention provides a surface processing device. The surface processing device can remove bubbles adhering to the surface and in holes of a work piece physically, and improve the surface processing ability. The surface processing device used for processing the surface of the work piece (20) is provided with a guide rail (201, 231-235); a transporting fixture (30) guided by the guide rail and transporting and retaining the work piece in a transporting direction (A) along the guide rail; a surface processing groove (200) used for surface processing of the work piece retained by the transporting fixture; a front processing groove (230A) arranged on a side of the upper stream of the transporting direction (A) of the surface processing groove and dipping the work piece retained by the transporting fixture into processing liquid (290) for processing; and a vibration giving part (500) giving vibration to the transporting fixture retaining the work piece dipped in the processing liquid in the preprocessing groove, thereby letting the work piece vibrate in the processing liquid.

Description

technical field [0001] The invention relates to a surface treatment device with a surface treatment tank and a pretreatment tank. Background technique [0002] As a surface treatment apparatus, for example, an electrolytic plating apparatus for electroplating the surface of a workpiece, a continuous electroplating apparatus for continuously conveying workpieces such as circuit boards in an electroplating bath is known. The workpieces are held pendulously by transport fixtures transported along the power supply rails (guide rails). The workpiece is continuously transported in the plating tank while being powered by the power supply rail via the transport jig. Anodes are arranged on both sides of a workpiece transport path serving as a cathode in the plating tank. Thus, an electric field is formed between the cathode and the anode, the electroplating solution is electrically decomposed, and the surface of the workpiece is electroplated. [0003] Here, there are known struct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/06C25D17/08C25D21/10
CPCC25D5/34C25D7/12C25D17/00C25D17/06C25D17/08C25D21/10C25D5/20C25D7/00C25D21/04
Inventor 野田朝裕渡边重幸
Owner ALMEX PE INC
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