Thermal module and electronic device adopting same

A heat dissipation module and electronic device technology, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problem of single heat dissipation of heat dissipation modules, and achieve the effect of saving quantity

Inactive Publication Date: 2012-04-11
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existing cooling modules

Method used

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  • Thermal module and electronic device adopting same
  • Thermal module and electronic device adopting same
  • Thermal module and electronic device adopting same

Examples

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Embodiment Construction

[0034] Figure 1 to Figure 3 A preferred embodiment of the electronic device 100 of the present invention is shown. The electronic device 100 includes a circuit board 10 and a heat dissipation module 20 .

[0035] The circuit board 10 is provided with a heating chip 11 and an electromagnetic interference source 12 . The heating chip 11 is located in the middle of the circuit board 10 and is a main heating element on the circuit board 10 .

[0036] The electromagnetic interference source 12 is disposed close to one side of the circuit board 10 and spaced from the heating chip 11 . The electromagnetic interference source 12 can be any component capable of emitting electromagnetic waves, such as pins of integrated circuits, connectors of cables, and electronic components. In this embodiment, the electromagnetic interference source 12 is a cable socket for electrically connecting a signal line 121 such as a TV signal line 121 to the circuit board 10 . When the electronic devic...

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Abstract

The invention discloses an electronic device. The electronic device comprises a circuit board and a thermal module; the circuit board is provided with a heating chip and an electromagnetic interference source; the thermal module comprises a heat conduction component and a shielding case with electricity and heat conduction performance; the electromagnetic interference source is arranged in the shielding case so as to perform electromagnetic shielding on the electromagnetic interference source; one end of the heat conduction component is connected with the heating chip; and the other end of the heat conduction component is connected with the shielding case in a heat conduction way, so heat which is produced by the heating chip is transmitted to the shielding case and is dispersed by the shielding case. The shielding case has the double functions of electromagnetic shielding and heat dissipation.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module used to dissipate heat for electronic components and an electronic device using the heat dissipation module. Background technique [0002] In electronic devices such as computers or communication products, due to the continuous increase in the power of chips, it is usually necessary to install a heat dissipation module to dissipate heat from the chips. However, the existing heat dissipation module can only play a single heat dissipation function. As electronic devices become lighter and thinner, the space that the heat dissipation module can occupy will be limited. How to make the heat dissipation module multifunctional and reduce the cost is an urgent problem to be solved. Contents of the invention [0003] In view of this, it is necessary to provide a multi-functional and low-cost cooling module. [0004] A heat dissipating module includes a heat conduc...

Claims

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Application Information

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IPC IPC(8): H01L23/427H01L23/552H05K7/20H05K9/00
CPCH01L2924/0002H01L2924/00
Inventor HONG RUIWEN
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD
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