Unlock instant, AI-driven research and patent intelligence for your innovation.

Packaging substrate

A technology for packaging substrates and substrates, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of complex packaging structures of light-emitting diodes, and achieve the effect of simple structures

Inactive Publication Date: 2014-04-09
ZHANJING TECH SHENZHEN +1
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is necessary to directly use AC power to supply power to the light-emitting diode, a rectifier circuit needs to be installed on the packaging substrate, so the packaging structure of the light-emitting diode is complicated.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging substrate
  • Packaging substrate
  • Packaging substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0029] See figure 1 and figure 2 , the first embodiment of the present invention provides a packaging substrate 100 for packaging light emitting diodes. The packaging substrate 100 includes a substrate body 10 , a rectifying device 20 and an insulating layer 30 .

[0030] In this embodiment, the substrate body 10 has a first surface 11 and a second surface 12 opposite thereto. The substrate body 10 has a first through hole 115 and a second through hole 116 passing through the first surface 11 and the second surface 12 . The first through hole 115 and the second through hole 116 are used to fill the first conductive material 13 and the second conductive material 14 respectively. In this embodiment, the second surface 12 of the substrate body 10 has a first electrical connection point 15 electrically connected to the first conductive mat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a packaging substrate. The packaging substrate, which is used for packaging a light emitting diode, comprises a substrate main body, a rectifying device and an insulating layer. The substrate main body has a first surface; a metal line layer is formed on the first surface; and a plurality of grooves are also formed on the first surface. The rectifying device includes a plurality of diodes that are respectively arranged in the grooves of the substrate; and the plurality of diodes are electrically connected through the metal line layer to form a bridge circuit. And the insulating layer is formed on the first surface of the substrate main body; and two output terminals of the bridge circuit pass through the insulating layer and are used for being electrically connected with a to-be-packaged light emitting diode.

Description

technical field [0001] The invention relates to a package substrate, in particular to a package substrate with the function of a bridge rectifier circuit. Background technique [0002] Currently, light emitting diodes (Light Emitting Diode, LED) have been widely used in many fields due to their characteristics of low power consumption, long life, small size and high brightness. [0003] When currently packaging light emitting diodes on a packaging substrate, generally the light emitting diodes are directly packaged on the packaging substrate. If it is necessary to directly use an AC power source to supply power to the light emitting diode, a rectification circuit needs to be provided on the package substrate, thus resulting in a complicated package structure of the light emitting diode. Contents of the invention [0004] A packaging substrate with the function of a bridge rectifier circuit will be described below with an embodiment. [0005] A packaging substrate is used...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L25/00
Inventor 沈佳辉洪梓健
Owner ZHANJING TECH SHENZHEN