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Jet solder bath and soldering apparatus

A technology of jet flow soldering and trough, which is applied in the direction of tin feeding device, welding equipment, printed circuit assembly of electric components, etc. It can solve problems such as poor bridging, poor burrs, and liquid level error of molten solder, so as to prevent defects, Space-saving and error-reducing effect

Active Publication Date: 2012-04-18
SENJU METAL IND CO LTD
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  • Claims
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Problems solved by technology

As a result, there is a problem that the liquid surface height of the molten solder jetted from the nozzle may vary, and there may be defects such as non-soldering in which the molten solder does not adhere to the printed circuit board, and solder adheres to other than the specified parts. Poor bridging and burrs

Method used

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  • Jet solder bath and soldering apparatus
  • Jet solder bath and soldering apparatus
  • Jet solder bath and soldering apparatus

Examples

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Embodiment Construction

[0024] Hereinafter, as an example of the embodiment of the present invention, a jet flow solder tank and a soldering device will be described with reference to the drawings.

[0025] Configuration example of soldering device 1

[0026] Such as figure 1 As shown, the soldering device 1 consists of a first jet flow solder tank (hereinafter referred to as "jet flow solder tank 5"), a second jet flow solder tank (hereinafter referred to as "jet flow solder tank 6"), a delivery robot 8 and the control unit 9 constitute. Furthermore, the soldering apparatus 1 has a transport rail part 2, a flux applicator part 3, a preheater part 4, a cooling part 7, a first protective shutter (hereinafter referred to as "baffle 11"), a second protective shutter (hereinafter referred to as "baffle 12"), a third protective shutter (hereinafter referred to as "baffle 13"), and a fourth protective shutter (hereinafter referred to as "baffle 14").

[0027] The transport rail portion 2 is used to tr...

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PUM

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Abstract

Provided are a jet solder bath and a soldering apparatus, wherein an liquid level error can be reduced and soldering failures can be eliminated. An operating unit sets the liquid level of a melted solder (20). An arm (81) is at a level that corresponds to the liquid level set by means of the operating unit for the melted solder (20) and moves to above a nozzle (53). An electrical continuity sensor (82) is provided on an arm (81), is moved to above the nozzle (53) by means of the arm (81), and detects that the liquid surface reached the level when the sensor is in contact with the liquid surface of the melted solder (20) jetted from the nozzle (53). Thus, the liquid level of the melted solder (20), which is jetted from the nozzle (53) to be soldered on a printed substrate, can be adjusted. As a result, since the liquid level of the melted solder (20) jetted from the nozzle (53) can be adjusted, the error of the liquid level of the melted solder (20) can be reduced compared with conventional jet solder baths wherein the liquid level of the melted solder is indirectly adjusted using sub-nozzles and dummy nozzles, and soldering failures can be eliminated.

Description

technical field [0001] The present invention relates to a jet solder tank and a soldering device that jet molten solder contained in a solder container from a nozzle and that can adjust the liquid level of the jet molten solder. Background technique [0002] As a method of soldering a printed wiring board, there is a dipping method in which a printed wiring board is brought into contact with molten solder and soldered. In this immersion method, for example, soldering is performed using a soldering device composed of a flux applicator, a preheater, a jet flow solder tank, a cooling device, etc., and performing soldering by applying the flux applicator to On the printed circuit board, the applied part is preheated with a preheater, the solder is adhered to the jet solder tank, and cooled with a cooling device. [0003] The jet solder tank installed on the soldering device is composed of a solder container, a pump, a nozzle, and the like. In this jet flow solder tank, the mol...

Claims

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Application Information

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IPC IPC(8): B23K1/08B23K1/00B23K3/06H05K3/34B23K101/42
CPCB23K2201/42B23K3/0653B23K2101/42
Inventor 大清水和宪高口彰桥本昇
Owner SENJU METAL IND CO LTD
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